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Large-size planar substrate coating method and device based on linear magnetron sputtering target gun

A flat substrate, magnetron sputtering technology, used in sputtering coating, vacuum evaporation coating, ion implantation coating and other directions, can solve the problems of poor uniformity of coating thickness, limited size of prepared samples, etc The uniformity is better than the effect of improving the uniformity of coating thickness and good coating quality

Active Publication Date: 2021-09-03
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the past research work, for the linear magnetron sputtering target gun, people limited the angle of sputtering particles incident on the substrate by adding a mask plate and a single set of partition plates to improve the quality of multilayer film coating, but this The method will lead to the limitation of the size of the prepared sample, and the further deterioration of the uniformity of the coating thickness.

Method used

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  • Large-size planar substrate coating method and device based on linear magnetron sputtering target gun
  • Large-size planar substrate coating method and device based on linear magnetron sputtering target gun
  • Large-size planar substrate coating method and device based on linear magnetron sputtering target gun

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Embodiment 1

[0036] The target gun is a linear magnetron sputtering target gun, and the size of the sputtering surface of the target gun is 38mm×508mm. The unique shape and larger size of the target gun will cause some particles to be incident at a larger angle, resulting in poor coating quality and poor thickness uniformity on large flat substrates. To solve this technical problem, the present invention provides a large-size planar substrate coating method based on a linear magnetron sputtering target gun. While controlling the coating quality of the sputtering target gun, the uniformity of the coating thickness on the large-size flat substrate is improved. In this embodiment, the sample holder is 600 mm long and 250 mm wide; the target distance is set to 100 mm.

[0037] Since the sputtering uniform area of ​​the target is limited, the method is suitable for large-size planar substrates with a length of 100 mm to 450 mm and a width of less than 200 mm. In this embodiment, the sample is...

Embodiment 2

[0047] In this embodiment, a large-size planar substrate coating device based on a linear magnetron sputtering target gun includes a linear magnetron sputtering target gun, a sample holder, and several groups of two-by-two partition plates. The plane where the sample holder is located Parallel to the plane where the linear magnetron sputtering target gun is located, the partition plate is installed in the horizontal direction perpendicular to the plane where the sample holder is located; when coating, the large-size flat substrate is installed at the center of the sample holder, and the partition plate is located where the substrate is located. Above the plane, the distance between the middle lines of two adjacent sets of partitions is obtained based on the simulation of the film deposition thickness distribution. All the other are with embodiment 1.

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Abstract

The invention relates to a large-size planar substrate coating method and device based on a linear magnetron sputtering target gun. The method includes the following steps: installing the large-size planar substrate at the center of a sample rack; Install several groups of partition plates in groups of two by two in the horizontal direction perpendicular to the plane, and the partition plates are located above the plane where the substrate is located; obtain the film deposition thickness distribution under each group of partition plates; based on the film deposition thickness The distribution simulation obtains the middle line spacing of two adjacent sets of partitions under the set thickness requirements; after adjusting the middle line spacing of each group of partitions, the linear magnetron sputtering target gun is used to realize the coating of large-size planar substrates. Compared with the prior art, the invention can improve the thickness uniformity of the coating on the large-size flat substrate while ensuring the coating quality of the linear magnetron sputtering target gun.

Description

technical field [0001] The invention belongs to the field of optical thin films, in particular to a method and device for coating a large-size flat substrate based on a linear magnetron sputtering target gun. Background technique [0002] Synchrotron radiation has high brightness, high collimation, and good coherence, and can emit a continuous spectrum ranging from far infrared to hard X-rays. It has important applications in the fields of life science, environmental science, condensed matter physics, and material science. It has become an irreplaceable light source for basic scientific research, applied research and high-tech product development in the world today. As an important X-ray optical element, the multilayer mirror plays an important role in the field of synchrotron radiation. In the X-ray band, in order to improve the reflectivity of the mirror, it is necessary to design a multi-layer film structure to coherently add the X-ray reflected light at each interface. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/54
CPCC23C14/35C23C14/54
Inventor 王占山齐润泽王长青
Owner TONGJI UNIV
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