Manufacturing method of power module and power module

A technology of power module and manufacturing method, which is applied in the direction of manufacturing tools, process efficiency improvement, semiconductor/solid-state device manufacturing, etc., can solve the problems of complex power module manufacturing process and low production efficiency, etc.

Active Publication Date: 2021-01-01
湖南国芯半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention provides a method for manufacturing a power module and a power module, which solves the problems of complex manufacturing process and low production efficiency of traditional power modules

Method used

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  • Manufacturing method of power module and power module
  • Manufacturing method of power module and power module
  • Manufacturing method of power module and power module

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0037] figure 2 Shown is a schematic flowchart of a method for manufacturing a power module in an embodiment of the present invention.

[0038] like figure 2 As shown, in an embodiment of the present invention, the manufacturing method of the power module includes:

[0039] Step 001: Prepare an integrated liner, wherein the integrated liner is prepared by an additive manufacturing method, and the preparation of the integrated liner includes prepar...

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Abstract

The invention provides a manufacturing method of a power module and the power module. The problems that a traditional power module is complex in manufacturing process and low in production efficiencyare solved. The embodiment of the invention provides a manufacturing method of a power module and the power module, the manufacturing method comprises the steps that an integrated lining plate is prepared, the integrated lining plate is prepared by adopting an additive manufacturing method, and the integrated lining plate comprises the steps that a first integrated lining plate and / or a second integrated lining plate are / is prepared; and a chip is assembled between the first integrated lining plate and the second integrated lining plate to form the power module.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for manufacturing a power module and the power module. Background technique [0002] Among semiconductor components, the power module used for high-power control has a lot of heat generation, so a good thermal design is an indispensable condition to ensure the stability and reliability of the device. The structure of the traditional double-sided heat dissipation power module is as follows, mainly including the lower liner, soldering layer, chip, welding (sintering) layer under the pad, pad, welding (sintering) layer on the pad, upper lining, lead frame and other structures The structure of the liner is a sandwich structure consisting of a middle ceramic layer and copper layers on both sides. The existing power module structure and manufacturing process depend on the manufacturing method of the current parts. In short, it is a "subtractive manufacturi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L23/473H01L21/52H01L25/04B22F3/105B28B1/00B33Y10/00
CPCH01L23/14H01L23/473H01L21/52H01L25/04B28B1/001B33Y10/00Y02P10/25
Inventor 柯攀齐放戴小平曾亮姚亮刘洋刘亮
Owner 湖南国芯半导体科技有限公司
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