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Tin dispensing machine for semiconductor production

A semiconductor and spot tin technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, and tin feeding devices, etc., can solve problems such as slow correction speed, pin point tin short circuit, virtual soldering, etc., to improve the stability of spot tin, The effect of reducing the rebound force

Pending Publication Date: 2021-01-05
杨保长
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When tinning the semiconductor, it is necessary to connect the pins to the semiconductor. During the tinning process between the pins and the semiconductor, the semiconductor will be deflected due to the jitter generated by the body. If the deflected semiconductor is not Adjustment, soldering directly to the deflected semiconductor may easily lead to poor conditions such as tin short circuit at the pin point and false soldering. It requires the staff to adjust the position of the semiconductor in real time, which increases the labor intensity of the staff, and the staff's deviation correction speed is slow , which affects the efficiency of spot tin in the semiconductor body and reduces the precision of spot tin in the semiconductor

Method used

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  • Tin dispensing machine for semiconductor production
  • Tin dispensing machine for semiconductor production
  • Tin dispensing machine for semiconductor production

Examples

Experimental program
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Effect test

Embodiment 1

[0031] see figure 1, the present invention provides a technical solution: a tin spotting machine for semiconductor production, the structure of which includes a body 1, an alignment device 2, a tin spotting head 3, a slide rail 4, a moving seat 5, a mounting frame 6, and a tin strip conduit 7 , the operation panel 8, the body 1 is provided with an alignment device 2, the alignment device 2 is installed on the body 1, the alignment device 2 is facing the tinning head 3, and the tinning head 3 There is a tin strip conduit 7 on the top, the tin strip conduit 7 is buckled on the tin point head 3, and the tin point head 3 is vertically inserted into the mounting frame 6, and the mounting frame 6 has a "concave" shape structure. The two ends of the installation frame 6 are connected with a little tin head 3, and the installation frame 6 is connected with the tin bar conduit 7 through the tin point head 3, and the bottom of the tin point head 3 is in contact with the bottom of the t...

Embodiment 2

[0041] see figure 1 , the present invention provides a technical solution: a tin spotting machine for semiconductor production, the structure of which includes a body 1, an alignment device 2, a tin spotting head 3, a slide rail 4, a moving seat 5, a mounting frame 6, and a tin strip conduit 7 , the operation panel 8, the body 1 is provided with an alignment device 2, the alignment device 2 is installed on the body 1, the alignment device 2 is facing the tinning head 3, and the tinning head 3 There is a tin strip conduit 7 on the top, the tin strip conduit 7 is buckled on the tin point head 3, and the tin point head 3 is vertically inserted into the mounting frame 6, and the mounting frame 6 has a "concave" shape structure. The two ends of the installation frame 6 are connected with a little tin head 3, and the installation frame 6 is connected with the tin bar conduit 7 through the tin point head 3, and the bottom of the tin point head 3 is in contact with the bottom of the ...

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PUM

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Abstract

The invention discloses a tin dispensing machine for semiconductor production, which structurally comprises a machine body, an alignment device, a tin dispensing head, a sliding rail, a moving seat, amounting frame, a tin bar guide pipe and an operation panel. When the tin dispensing machine is used after being improved, the semiconductor circuit board is mounted on the two clamping pieces duringuse; the tin dispensing head can generate a tiny vibration feeling in the tin dispensing process of the semiconductor circuit board, the abutting piece can pop up outwards after being pressed, the elastic piece can push the clamping arms upwards to be tightly attached to the two sides of the semiconductor circuit board, the semiconductor circuit board is stably clamped; when clamping the slidingblock, the two opening and closing clamping plates can be opened outwards, a spring in the elastic traction piece is subjected to outward expansion force of the opening and closing clamping plate to generate traction force with the movable pull disc, and the pull rod is subjected to mutual exclusion force between the opening and closing clamping plate and the elastic traction piece to stably limitthe opening and closing clamping plate at an adjusting position, and therefore the semiconductor circuit board can be stably positioned at the adjusting position for tin soldering; the tin dispensingprecision and the tin dispensing efficiency of the semiconductor are improved.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a tin spotting machine for semiconductor production. Background technique [0002] Spot tin is an important industrial raw material for connecting electronic components in the soldering circuit. It mainly refers to solder made of tin-based alloys. With the gradual maturity of electronic technology, the internal pins of electronic products usually need to be tinned by spot tin equipment. On the semiconductor, when the semiconductor is tinned, it is necessary to accurately position the position of the semiconductor through the alignment element, so that the pin can be accurately tinned on the semiconductor. When tinning the semiconductor, the areas that need to be improved: [0003] When tinning the semiconductor, it is necessary to connect the pins to the semiconductor. During the tinning process between the pins and the semiconductor, the semiconductor will be deflected du...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60B23K3/06B23K3/08B23K37/04
CPCB23K3/06B23K3/087H01L24/74H01L24/75H01L2224/75001H01L2224/757H01L2224/75701H01L2224/75981
Inventor 杨保长
Owner 杨保长