Method, apparatus and system for determining optimum operation recipe for optical film-thickness measuring device

A measuring device, optical technology, applied in the direction of measuring device, grinding device, work carrier, etc., can solve the problems of time-consuming, time-consuming, dependence, etc.

Pending Publication Date: 2021-01-15
EBARA CORP
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are multiple plan parameters constituting the work plan, and it takes time to optimize these plan parameters
In particular, since the user adjusts the protocol parameters by trial and error, making the optimal working protocol is not only time-consuming, but also depends on the user's skill

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method, apparatus and system for determining optimum operation recipe for optical film-thickness measuring device
  • Method, apparatus and system for determining optimum operation recipe for optical film-thickness measuring device
  • Method, apparatus and system for determining optimum operation recipe for optical film-thickness measuring device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0080] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 It is a schematic diagram which shows one embodiment of a grinding|polishing apparatus. Such as figure 1 As shown, the polishing device has: a polishing table 3 supporting the polishing pad 2; a wafer W as an example of a substrate is pressed on the polishing head 1 of the polishing pad 2; a table motor 6 is made to rotate the polishing table 3; A slurry supply nozzle 5 for supplying slurry. The upper surface of the polishing pad 2 constitutes a polishing surface 2 a for polishing the wafer W. As shown in FIG.

[0081] The grinding head 1 is connected to the head shaft 10, and the grinding head 1 and the head shaft 10 rotate together in the direction indicated by the arrow. The polishing table 3 is connected to a table motor 6, and the table motor 6 is configured to rotate the polishing table 3 and the polishing pad 2 in the direction indicated by the arrow. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A method, apparatus and system of automatically determining optimum recipe parameters constituting an operation recipe of an optical film-thickness measuring device within a short period of time are disclosed. The method includes storing in a memory a plurality of parameter sets each including a plurality of recipe parameters constituting an operation recipe; performing simulation of change in film thickness with polishing time with use of the plurality of parameter sets and data of reference spectra of reflected light from a polished substrate, the reference spectra being stored in a data server; inputting at least one index value for evaluating a manner of the change in film thickness into an evaluation calculation formula to calculate a plurality of comprehensive evaluation values for the plurality of parameter sets; and selecting an optimum one of the plurality of parameter sets based on the plurality of comprehensive evaluation values.

Description

technical field [0001] The present invention relates to a method, an apparatus and a system for determining an optimal operation scheme of an optical film thickness measuring device for measuring the film thickness of a substrate such as a wafer during polishing of the substrate. Background technique [0002] In the manufacturing process of semiconductor devices, various materials are repeatedly formed into films on a silicon wafer to form a laminated structure. In order to form this laminated structure, a technique for flattening the surface of the uppermost layer is important. Chemical mechanical polishing (CMP) is used as a means of such planarization. [0003] Chemical mechanical polishing (CMP) is performed by a polishing device. Such a polishing apparatus generally has a polishing table that supports a polishing pad, a polishing head that holds a substrate (for example, a wafer with a film), and a polishing liquid supply nozzle that supplies a polishing liquid onto t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B24B37/11B24B37/27B24B37/34B24B49/12
CPCB24B37/00B24B37/11B24B37/27B24B37/34B24B49/12H01L21/67253H01L22/12H01L22/20H01L21/67H01L22/26B24B37/005G06F30/20G01N21/9501G01N21/25H01L22/10G06F2119/18B24B49/05H01L21/30625
Inventor 渡边夕贵
Owner EBARA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap