High-frequency link interconnected three-port MMC-SST topology and control strategy

A high-frequency chain, three-port technology, applied in the field of three-port MMC-SST topology and control strategy, can solve the problems of a large number of detection circuits and control computing resources, and achieve the elimination of detection circuits and control resources, high efficiency, good soft switching characteristics Effect

Inactive Publication Date: 2021-01-15
YANSHAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these are all realized based on the closed-loop control of additional circuits, which require a large number of detection circuits and control computing resources.
And all

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  • High-frequency link interconnected three-port MMC-SST topology and control strategy
  • High-frequency link interconnected three-port MMC-SST topology and control strategy
  • High-frequency link interconnected three-port MMC-SST topology and control strategy

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Embodiment Construction

[0036] Below in conjunction with embodiment the present invention is described in further detail:

[0037] Such as Figure 1a As shown, a three-port MMC-SST topology interconnected by high-frequency links, the first power switch tube Q of the first isolation sub-module of the upper bridge arm of each phase 1 and the second power switch Q 2 The composed midpoint is connected to the positive pole of the high-voltage direct current bus (HVDC); the second power switch tube Q 2 source and the first power switch tube Q of the next isolation sub-module 1 The source is connected; the upper bridge arm inductance L g1 , L g3 , L g5 One end of the upper bridge arm of each phase and the second power switch tube Q of the last isolation sub-module 2 The source connection of the three-phase upper arm inductance L g1 , L g3 , L g5 The other ends of the high-voltage AC bus (HVAC) are respectively connected to phase a, phase b and phase c; the three-phase lower bridge arm inductance L ...

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Abstract

The invention discloses a high-frequency link interconnected three-port MMCSST topology. The topology comprises a modular multilevel converter structure, a half-bridge and capacitor structure, a resonant push-pull converter and a three-phase bridge arm, wherein the resonant push-pull converter and the half-bridge and capacitor structure form an isolation sub-module; a high-frequency link of the resonant push-pull converter interconnects all the isolation sub-modules together to form a low-voltage direct-current bus, each phase of bridge arm in the three-phase bridge arm is divided into an upper bridge arm and a lower bridge arm, each phase of upper bridge arm comprises n isolation sub-modules and upper bridge arm inductors Lg1, Lg3 and Lg5, and each phase of lower bridge arm comprises n isolation sub-modules and lower bridge arm inductors Lg2, Lg4 and Lg6, according to the topology, SM capacitor voltage ripples and double-frequency circulating currents in bridge arms are eliminated, and voltage balance among all SM is realized.

Description

technical field [0001] The invention relates to the field of a solid-state transformer applied to a medium-low voltage hybrid AC-DC networking system, in particular to a three-port MMC-SST topology and control strategy for high-frequency link interconnection. Background technique [0002] With the increase of renewable energy penetration rate and the gradual increase of the proportion of DC load, DC system has been more and more widely used in power transmission and smart grid. Compared with the AC system, the DC system has more advantages in reducing the number of conversion stages, reducing transmission loss, avoiding harmonics and reactive power, and improving system response speed and stability. Hybrid AC and DC transformer technology has also received more and more attention. Solid-state transformers, also known as power electronic transformers, are new power electronic devices that combine power electronics technology with high-frequency power conversion technology. ...

Claims

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Application Information

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IPC IPC(8): H02M3/337H02M1/14H02J3/36
CPCH02J3/36H02M1/14H02M3/3378Y02B70/10Y02E60/60
Inventor 孙孝峰滕甲训潘禹卓李昕
Owner YANSHAN UNIV
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