Chipless RFID tag based on time domain scattering modulation
An RFID tag, chipless technology, applied in the field of radio frequency identification technology, can solve the problem of lack of low-cost chipless tags, and achieve the effect of compact structure, low cost and large coding capacity
Active Publication Date: 2021-01-22
ZHEJIANG UNIV
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Problems solved by technology
[0005] At present, there is a lack of a chipless tag structure and processing that integrates low cost, compact size, and large encoding capacity.
Method used
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[0038] Below in conjunction with accompanying drawing and specific embodiment the present invention is further described
[0039] Such as figure 1 As shown, the chipless RFID tag includes a multi-layer patch antenna structure and a coded metal slide 6. The patch antenna structure includes a first layer of metal copper sheet 1 and a second layer of dielectric board 2 that are sequentially stacked from top to bottom. , the third layer of metal grounding 3, the fourth layer of dielectric board 4 and the fifth layer of coding layer 5; the fifth layer specifically includes coding metal slides 6, lumped resistors 9, circular metal pads 7 and crescent-shaped metal pads 8. Both the circular metal pad 7 and the crescent-shaped metal pad 8 are arranged on the bottom surface of the fourth dielectric board 4, and a lumped resistor 9 is connected between the circular metal pad 7 and the crescent-shaped metal pad 8, and the third A through hole 12 is opened on the layer metal ground 3, and...
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The invention discloses a chipless RFID (Radio Frequency Identification Device) tag based on time domain scattering modulation. The RFID tag comprises a patch antenna structure and a coding metal slipsheet, wherein the patch antenna structure comprises five layers of structures; in the fifth layer, the circular metal bonding pad and the crescent metal bonding pad are both arranged on the bottom surface of the fourth layer of dielectric plate, a lumped resistor is connected between the circular metal bonding pad and the crescent metal bonding pad, and the circular metal bonding pad is connected with the first layer of metal copper sheet through a long metal shaft; the bottom surface of the third-layer metal grounding is connected with a short metal shaft, penetrates out of the fourth-layerdielectric plate and then covers an encoding metal sliding sheet together with the bottom surface of the crescent metal bonding pad; the encoding metal slip sheet slides relative to the patch antennastructure and is in electric contact with the short metal shaft and the crescent metal bonding pad in the sliding process; the coding metal slip sheet is formed by arranging rectangular metal patcheson a strip-shaped dielectric substrate at intervals. The RFID tag has advantages of low cost, compact structure, small thickness and large coding capacity, and can be widely applied to various fieldsrelated to identity recognition, such as access control systems, commercial logistics, enterprise supply chains and the like.
Description
technical field [0001] The invention belongs to a tag of radio frequency identification technology (RFID), in particular to a chipless RFID tag based on time domain scattering modulation. Background technique [0002] Radio frequency identification technology (RFID) is a non-contact automatic identification technology, which realizes information transmission and reception through the spatial coupling of electromagnetic fields, so as to achieve the purpose of identification. However, traditional RFID tags use silicon chips, which are relatively expensive and cannot be widely used in low-cost fields. [0003] Chipless RFID technology is a new field of radio frequency identification technology. The tags it uses do not use traditional silicon chips, but use the particularity of the manufacturing materials, or achieve specific electromagnetic characteristics through the special layout of the tag structure, and then realize the data. Encoding, storage. After more than ten years ...
Claims
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IPC IPC(8): G06K19/077
CPCG06K19/07722G06K19/07773
Inventor 黄正杰叶德信皇甫江涛
Owner ZHEJIANG UNIV