Conformal carbon film deposition

Abstract

Methods for depositing an amorphous carbon layer on a substrate are described. A substrate is exposed to a carbon precursor having a structure of Formula (I). Also described are methods of etching a substrate, including forming an amorphous carbon hard mask on a substrate by exposing the substrate to a carbon precursor having the structure of Formula (I).

Description

Technical field[0001]The embodiments of the present disclosure relate to the field of electronic device manufacturing, and in particular, to integrated circuit (IC) manufacturing. More specifically, the embodiments of the present disclosure provide a method of depositing a conformal carbon film, which can be used for patterning applications.Background technique[0002]Integrated circuits have evolved into complex devices that can include millions of transistors, capacitors, and resistors on a single chip. The development of chip design continues to require faster circuit systems and greater circuit density. The demand for faster circuits with greater circuit density places corresponding demands on the materials used to manufacture such integrated circuits. Specifically, as the size of integrated circuit components decreases, it is necessary to use low-resistivity conductive materials and low dielectric constant insulating materials to obtain appropriate electrical properties from such...

AI Technical Summary

Problems solved by technology

However, multiple patterning schemes are required to form conformal and ashable films

[0005] Typically, ALD is used to deposit conformal films, but ALD is not a viable deposition technique for depositing carbon films

Images