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A kind of zinc-based high-temperature lead-free solder and production method thereof

A lead-free solder, production method technology, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of poor wettability and spreadability, difficult to apply welding of fuse tube electronic components, easy oxidation and so on , to achieve the effect of good welding reliability, stable quality and smooth production

Active Publication Date: 2022-07-26
好利来(厦门)电路保护科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For the liquidus point of 355-385 ℃, zinc-based zinc-tin solder as the base material has no precedent for soldering electronic components, and it is a blank area. At the same time, high-zinc zinc-tin solder is easy to oxidize after melting, so its wettability and spreading It is difficult to apply to the welding of various electronic components such as fuse tubes. Even if it is applied, it needs to cooperate with special flux and special welding equipment to ensure welding reliability.

Method used

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  • A kind of zinc-based high-temperature lead-free solder and production method thereof
  • A kind of zinc-based high-temperature lead-free solder and production method thereof
  • A kind of zinc-based high-temperature lead-free solder and production method thereof

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Embodiment Construction

[0021] In order to further explain the technical solutions of the present invention, the present invention will be described in detail below through specific embodiments.

[0022] The invention discloses a zinc-based high-temperature lead-free solder, which contains 50% to 80% by weight of zinc, and also contains any one or any two of aluminum, bismuth, palladium, nickel, germanium or phosphorus. As additional trace elements, the weight percentages of the above-mentioned additional trace elements are: aluminum 0-0.09%, bismuth 0-3%, palladium 0-0.08%, nickel 0-0.05%, germanium 0-0.006% or phosphorus 0-0.03% %, the remainder is tin. Among them, the composition ratio of zinc and tin is designed to achieve the liquidus point of the solder required for a large rated current fuse tube in a more suitable temperature range of 355-385°C.

[0023] Further, the weight percentage of aluminum may be 0.01-0.09%. The weight percentage of bismuth may be 0.6-3%. The weight percentage of pa...

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Abstract

A zinc-based high-temperature lead-free solder, which contains 50% to 80% by weight of zinc, and also contains any one or two of aluminum, bismuth, palladium, nickel, germanium or phosphorus as additional trace elements, And the weight percentages of the above-mentioned additional trace elements are respectively: aluminum 0-0.09%, bismuth 0-3%, palladium 0-0.08%, nickel 0-0.05%, germanium 0-0.006% or phosphorus 0-0.03%, the balance is tin. The soldering tin of the invention can achieve good welding effect, and when the subsequent protection circuit of the high rated current fuse tube fuses, the solder in the end cap of the fuse tube does not overflow the outside of the tube.

Description

technical field [0001] The invention relates to a solder in a fuse, in particular to a zinc-based high-temperature lead-free solder. Background technique [0002] With the development trend of the miniaturization of electronic and electrical equipment and components and the increase of power at the same time, the rated current of electronic components such as fuse tubes needs to be continuously improved. The end cap of the fuse tube and the fusible metal wire are welded by solder brazing. When the fuse tube is used for overload protection, the fusible metal wire in the fuse tube will maintain a high temperature for a certain period of time until it fuses, and the greater the current. It generates a lot of heat, so it is easy to appear that when the fuse tube is blown, the solder that welds the fusible metal wire and the end cap together in the end cap is melted and flows out from the gap between the tube body and the end cap, or even drips to the external circuit. The pheno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/28B23K35/40
CPCB23K35/282B23K35/40
Inventor 赖文辉李湖明苏志刚胡兴华赖凯连筱乐
Owner 好利来(厦门)电路保护科技有限公司
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