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Metal-phobic material and application thereof

A metal material and metal technology, which is applied in the field of metal-phobic materials and its applications, can solve the problems of high surface tension of liquid metal, high production cost, and limited application, so as to improve production efficiency, reduce production cost, and expand the scope of application. Effect

Active Publication Date: 2021-02-02
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface tension of liquid metal is extremely high. At present, liquid metal patterns can only be formed on a small number of substrates by direct printing, but cannot be printed directly, which makes the production efficiency of liquid metal patterns low, high production cost, and limited applications.

Method used

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  • Metal-phobic material and application thereof
  • Metal-phobic material and application thereof
  • Metal-phobic material and application thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0071]The composition of thin metal materials is as follows:

[0072] Material type Specific selection Dosage proportion Resin film former Vinyl resin 10g24.4％ Solvent Ethylene glycol butyl ether 20g48.8％ Metal sparse functional powder Mercerized Mica 10g24.4％ Dispersant BYK110 1g2.4％ total 41g100％

[0073]The preset temperature of the aforementioned metallic material is 120 degrees Celsius.

example 2

[0075]The composition of thin metal materials is as follows:

[0076] Material type Specific selection Dosage proportion Resin film former polyester resin 12g24.5％ Solvent Butyl acetate 20g40.8％ Metal sparse functional powder Montmorillonite powder 15g30.6％ Dispersant BYK110 2g4.1％ total 49g100％

[0077]The preset temperature of the aforementioned metallic material is 140 degrees Celsius.

example 3

[0079]The composition of thin metal materials is as follows:

[0080]

[0081]

[0082]The preset temperature of the aforementioned metallic material is 146 degrees Celsius.

[0083]In addition, the present invention provides the application of any one of the above-mentioned metal-phobic materials. The metal-phobic material is used in electronic devices with liquid metal circuits, or in liquid metal printing, or in structures that are isolated from liquid metal.

[0084]The above-mentioned structure of alienating liquid metal can be containers, platforms, tools, etc. that need to be contacted during production, production, storage, transportation, and use of liquid metal, such as ink cartridges, ink distribution tables, ink distribution rollers, doctor blades, pipelines, and Structures such as metal substrates, and metal sparse materials are present in the above structures in the form of coatings.

[0085]When the metal-phobic material is applied to liquid metal printing, optionally, such asimage 3 A...

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Abstract

The invention provides a metal-phobic material and application thereof, and relates to the technical field of liquid metal. The metal-phobic material comprises the following components in percentage by weight: 10%-50% of a resin film forming matter, 10%-40% of hydrophobic metal functional powder and 10%-50% of a solvent, under the condition that the environment temperature is lower than the presettemperature, the metal-phobic material is separated from the liquid metal, and the liquid metal is a metal simple substance or alloy with the melting point being 300 DEG C or below or a conductive fluid with the metal simple substance or alloy as the main component. According to the technical scheme, direct printing of the liquid metal can be achieved, then the manufacturing efficiency of the liquid metal pattern is improved, the manufacturing cost is reduced, and the application range of the liquid metal is widened.

Description

Technical field[0001]The invention relates to the technical field of liquid metal, in particular to a metal-phobic material and its application.Background technique[0002]In the field of traditional electronic printing, the preparation of electronic circuits often requires a complicated process, and the preparation process is accompanied by waste of resources and environmental pollution. For example, the copper plate etching process in the traditional circuit preparation method requires that metal copper is plated on the circuit substrate (usually glass fiber board) in advance, and then the excess metal copper is removed by chemical etching or laser engraving, and finally formed on the substrate surface Copper circuit of specific shape. This preparation process has a long processing time, a complicated process, and high requirements for manufacturing equipment.[0003]In today's society, people's demand for personalized customized products is increasing, but the technical solutions for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/106C09D11/104C09D11/03C09D127/06C09D167/00C09D7/61H05K1/09H05K3/12
CPCC09D11/106C09D11/104C09D11/03C09D127/06C09D167/00C09D7/61H05K1/092H05K3/12H05K3/1208C08K3/34C08K3/346Y02P10/25
Inventor 董仕晋郑翰
Owner BEIJING DREAM INK TECH CO LTD
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