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Adhesive composition containing acrylonitrile butadiene rubber copolymerized polyamide imide resin

A technology of polyamide-imide resin and acrylonitrile butadiene, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., and can solve the problems of reduced bonding strength, poor embedding function, and poor economic efficiency, etc. Improve solder heat resistance and excellent temporary adhesion

Active Publication Date: 2021-02-02
日本旗胜株式会社 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in general, high-boiling-point solvents such as N-methyl-2-pyrrolidone are used as solvents for wholly aromatic polyimide resin varnishes obtained by polymerization of only aromatic monomers. / Curing requires a long curing process at a high temperature of 200°C or higher, and there is a problem of thermal deterioration of electronic components
[0008] In addition, since wholly aromatic polyimide resins generally have a high glass transition temperature, there is a problem in that when the adhesive is thermally bonded to the base material of polyimide film and copper foil, The embedding function deteriorates and the bonding strength decreases
[0011] However, the polysiloxane-modified polyimide resins described in Patent Documents 1 and 2 use expensive diamines having dimethylsiloxane bonds as raw materials, resulting in poor economic efficiency.
In addition, there is a problem that the adhesiveness decreases as the amount of polysiloxane copolymerization increases
In addition, in the polyamide-imide resin described in Patent Document 3, it is necessary to increase the copolymerization amount of acrylonitrile butadiene, and as a result, the insulation reliability may be lowered.

Method used

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  • Adhesive composition containing acrylonitrile butadiene rubber copolymerized polyamide imide resin
  • Adhesive composition containing acrylonitrile butadiene rubber copolymerized polyamide imide resin
  • Adhesive composition containing acrylonitrile butadiene rubber copolymerized polyamide imide resin

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Experimental program
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Embodiment

[0144] In order to explain the present invention more specifically, examples are given below, but the present invention is not limited thereto. In order to further specifically describe the present invention, the following examples are given, but the present invention is not limited thereto. In addition, the characteristic value in the example was evaluated by the following method.

[0145]

[0146]The polyamideimide resin (A1) or the NBR copolymerized polyamideimide resin (A2) was dissolved in N-methyl-2-pyrrolidone so that the polymer concentration was 0.5 g / dl. Using an Ubbelohde viscosity tube, the solution viscosity and the solvent viscosity of the solution were measured at 30° C., and the logarithmic viscosity was calculated according to the following formula.

[0147] Logarithmic viscosity (dl / g)=[ln(V1 / V2)] / V3

[0148] V1: Calculated from the time required for the solvent (N-methyl-2-pyrrolidone) to pass through the capillary of an Ubbelohde viscosity tube

[0149...

manufacture example 1

[0201] (Production Example 1) Synthesis of polyamideimide resin (A1-1)

[0202] 268.98 g (1.40 mol) of trimellitic anhydride and 315.32 g (1.26 mol) of 4,4'-diphenylmethane diisocyanate (MDI) as a diisocyanate were added to 710.09 g of N-methyl-2-pyrrolidone and dissolved. Then, reaction was carried out at 140° C. for 5 hours while stirring under a nitrogen stream, and then, 169.07 g of dimethylacetamide was added to dilute and cooled to room temperature to obtain a brown product with a non-volatile content of 35% by mass. Viscous polyamideimide resin solution (A1-1).

manufacture example 2

[0203] (Production Example 2) Synthesis of NBR Copolymerized Polyamide-imide Resin (A2-1)

[0204] 248.54 g (1.29 moles) of trimellitic anhydride, 225.40 g (0.06 moles) of NBR, 8.49 g (0.04 moles) of sebacic acid, 353.85 g (1.41 moles) of 4,4'-diphenylmethane diisocyanate (MDI) as diisocyanate ) was added to 1069.59 g of dimethylacetamide and dissolved. Then, the reaction was carried out at 140° C. for 5 hours while stirring under a nitrogen flow, and then, 594.22 g of dimethylacetamide was added to dilute, and cooled to room temperature to obtain a brown product with a non-volatile content of 30% by mass. Viscous NBR copolymerized polyamideimide resin solution (A2-1).

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Abstract

The present invention provides an adhesive composition which has improved solder heat resistance after moisture absorption, excellent flowability and excellent B-stage adhesive film provisional bondability, while exhibiting adhesiveness, insulation reliability, flame retardancy and B-stage adhesive film embrittlement resistance. An adhesive composition which contains (A1) a polyamide imide resin that does not contain an acrylonitrile butadiene rubber, (A2) an acrylonitrile butadiene rubber copolymerized polyamide imide resin, and (B) an epoxy resin that has two or more epoxy groups in each molecule, and which forms a homogeneous phase. With respect to this adhesive composition, (i) the A1 / A2 mass ratio in the composition is from 0.1 to 1.0 (inclusive), (ii) the (A1 + A2) / B mass ratio in the composition is from 0.9 to 3.6 (inclusive), and (iii) the component (A2) is a resin which comprises, as copolymerization components, (a) a polycarboxylic acid derivative having an acid anhydride group, (b) an isocyanate compound or an amine compound, and (c) an acrylonitrile-butadiene rubber having carboxyl groups at both ends, and which is configured such that if constituent units derived fromall acid components of the component (A2) is taken as 100 mol%, the ratio of the constituent unit derived from the acid component (a) is 90-99 mol%, and the ratio of the constituent unit derived fromthe acid component (c) is 1-5 mol%.

Description

technical field [0001] The present invention relates to an adhesive composition comprising an acrylonitrile butadiene rubber copolymerized polyamideimide resin, and more specifically relates to an adhesive composition excellent in adhesiveness, heat resistance, insulation, flexibility, flame retardancy, and fluidity , Suitable for adhesive compositions in cover films, adhesive films, 3-layer copper clad laminates, etc. Background technique [0002] In general, flexible printed wiring boards (hereinafter also referred to as FPCs) are suitable for wiring board materials and substrate materials for mounting of electronic devices requiring flexibility and miniaturization. Widely used in, for example, device mounting substrates for display devices used in liquid crystal displays, plasma displays, organic EL displays, etc., relay cables between substrates such as smartphones, tablet device terminals, digital cameras, and portable game machines, and operation switch units substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C09J11/06C09J163/00
CPCC09J11/06C09J163/00C09J179/08C09J2301/312C09K21/04
Inventor 神田良辅薗田辽小柳英之川楠哲生岩崎真志加藤高久海老原智大类学铃木源太郎
Owner 日本旗胜株式会社