Unlock instant, AI-driven research and patent intelligence for your innovation.

Conductive adhesive composition

A conductive and bonding agent technology, applied in the direction of conductive adhesives, adhesive types, adhesive additives, etc., can solve the problems of electronic parts damage, printed substrate distortion, etc., and achieve the effect of strong adhesion

Active Publication Date: 2020-03-24
TATSUTA ELECTRICWIRE & CABLE
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, on printed circuit boards on which electronic components are mounted, the printed circuit boards may be bent during use, distorting the parts where the electronic components are mounted, or breaking the electronic components.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conductive adhesive composition
  • Conductive adhesive composition
  • Conductive adhesive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0168] The present invention will be specifically described below based on examples, but the present invention is not limited by these examples. In addition, "part" and "%" in an Example and a comparative example represent a mass standard unless otherwise indicated.

[0169] (1) Production of polyurethane (polyurea) resin (F)

Synthetic example 1

[0171] A stirrer, a reflux condenser, a thermometer, a nitrogen sparging tube, and a reaction vessel with a manhole were prepared. The inside of the reaction vessel was replaced with nitrogen, and then 1.4 g of dimethylolpropionic acid (DMPA) and polyhexamethylene carbonate diol (trade name "Praccel CD220", DAICEL Co., Ltd.) were added. Produced by the company, the number average molecular weight obtained by quantifying the terminal functional group (terminal functional group) is 200.0g, and dimethylformamide (DMF) 83.5g, and then add isophorone diisocyanate (isophorone diisocyanate) (IPDI) 49.0g (with respect to OH group, NCO group is 2 times equivalent (equivalent)), heated to 90°C, and reacted until NCO% reached 2.8%, to obtain urethane Prepolymer (prepolymer). Next, DMF83.5g was added, and it cooled to below 40 degreeC.

[0172] Then, 17.5 g of isophorone diamine (IPDA) was diluted with 175 g of a mixed solvent obtained by mixing DMF / Isopropyl Alcohol (IPA) at a ratio of...

Synthetic example 2

[0175] Dimethylolpropionic acid (DMPA), isophorone diisocyanate (IPDI), dimethylformamide (DMF) and dimethylformamide (DMF ) / Isopropyl alcohol (Isopropyl alcohol) was added in the amount described in Table 1. Others were synthesized in the same manner as in Synthesis Example 1 to obtain an acid value of 26.4 mgKOH / g and a weight average molecular weight of 65,000. , A polyurethane (polyurea) resin (F-2-1) with a solid content of 30% (DMF / Isopropyl Alcohol).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
acid valueaaaaaaaaaa
acid valueaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The present invention provides a conductive adhesive composition, which contains at least: a polyol (polyol) compound (A), a diisocyanate (diisocyanate) compound (B) and a carboxyl group-containing diol (diol) compound (C) polyurethane (polyurea) resin (F) obtained by reacting urethane prepolymer (D) obtained by reaction with polyamine compound (E), Epoxy resin (G) containing two or more epoxy groups, conductive filler (H), among them, polyurethane (polyurea) resin (F) has an acid value of 1~6mgKOH / g of polyurethane (polyurea) resin (F-1) and acid value of 18~30mgKOH / g of polyurethane (polyurea) resin (F-2).

Description

technical field [0001] The invention relates to a conductive bonding agent composition, a conductive bonding film and an electromagnetic wave shielding film made of the same. Background technique [0002] Conventionally, conductive adhesives composed of conductive fillers and resin compositions have been used in printed circuit boards, conductive adhesive films, and electromagnetic wave shielding films. This conductive adhesive needs to have good heat resistance that can withstand the reflow soldering process, maintain high adhesion and low connection resistance when exposed to high temperature and high humidity environments, and can be applied to printed substrates. Fill the openings with a conductive adhesive for filling properties. In addition, on printed circuit boards on which electronic components are mounted, the printed circuit boards may be bent during use, distorting the parts where the electronic components are mounted, or breaking the electronic components. The...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/04C09J7/30C09J9/02C09J11/02C09J163/00H05K1/03C09J7/20
CPCC09J9/02C09J11/02C09J163/00C09J175/04H05K1/03C09J7/20
Inventor 山本翔久岩井靖
Owner TATSUTA ELECTRICWIRE & CABLE