Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electromagnetic wave shielding film

An electromagnetic wave and shielding film technology, applied in the field of electromagnetic wave shielding film, can solve problems such as adverse health effects, signal interference or failure, and achieve the effects of excellent mechanical strength, flexibility, and excellent electrical insulation

Pending Publication Date: 2021-02-12
LG CHEM LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Electromagnetic waves emitted to the outside have adverse effects on health, and cause signal interference or malfunction problems to the electronic device itself or other equipment including the electronic device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electromagnetic wave shielding film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] The metal foam is a copper metal foam in which a copper foam having a porosity of about 70% or so and a pore size of about 90% or more of pores determined by the above method is 10 μm is used. This metal foam is produced in the following manner. 130g average particle diameter (median diameter, D50 particle diameter) is the copper powder of about 60 μm, 110g texanol, 14g isobutyl isobutyrate, 6g ethylcellulose and 2g leveling agent (ACME Co., Ltd. , Surfadol 338) were mixed to prepare a slurry. The slurry is coated in the form of a film with a thickness of around 350 μm, dried in an oven at 120°C for 30 minutes, and then sintered at around 1,000°C in a hydrogen / argon atmosphere for about 2 hours to produce metal foam.

[0072] figure 1 It is the photo of the copper foam used in Example 1. The copper metal foam was dipped into a thermosetting silicone resin (Dow Corning, PDMS) and the excess composition was removed using a film applicator such that the thickness of the...

Embodiment 2

[0074]The metal foam is a copper metal foam in which a copper foam having a porosity of about 70% or so and a pore size of about 90% or more of pores determined by the above method of 50 μm is used. The metal foam was produced in the same manner as in Example 1, except that it was used by adding to the slurry applied in Example 1 10 g of polymeric foam with an average particle size (median particle size, D50 particle size) of about 50 μm. Slurries prepared with beads as an additional component. A composite material was produced using metal foam in the same manner as in Example 1. The electromagnetic wave shielding efficiency of the electromagnetic wave shielding film determined by the above method was about 95 dB or more at 100 kHz to 3 GHz and about 85 dB or more at 1.5 GHz to 18 GHz.

Embodiment 3

[0076] The metal foam is a copper metal foam in which a copper foam having a porosity of about 70% or so and a pore size of about 90% or more of pores determined by the above method is 100 μm is used. The metal foam was produced in the same manner as in Example 1, except that it was used by adding to the slurry applied in Example 1 10 g of polymeric foam with an average particle size (median particle size, D50 particle size) of about 100 μm. Slurries prepared with beads as an additional component.

[0077] A composite material was produced using metal foam in the same manner as in Example 1. The electromagnetic wave shielding efficiency of the electromagnetic wave shielding film determined by the above method was about 90 dB or more at 100 kHz to 3 GHz and about 75 dB or more at 1.5 GHz to 18 GHz.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The present application relates to an electromagnetic wave shielding film, and can provide an electromagnetic wave shielding film having excellent electromagnetic wave shielding ability and also having excellent mechanical strength, flexibility, electrical insulation, adhesiveness to other elements, stability against oxidation and high temperature, etc.

Description

technical field [0001] This application claims priority based on Korean Patent Application No. 10-2018-0075962 filed on June 29, 2018, the disclosure of which is incorporated herein by reference in its entirety. [0002] This application relates to an electromagnetic wave shielding film. Background technique [0003] Problems caused by electromagnetic waves generated in various electronic devices are various. Electromagnetic waves emitted to the outside have adverse effects on health, and cause signal interference or malfunction problems to the electronic device itself or other equipment including the electronic device. Contents of the invention [0004] technical problem [0005] This application relates to an electromagnetic wave shielding film. An object of the present application is to provide an electromagnetic wave shielding film which has excellent electromagnetic shielding ability, has good mechanical strength, electrical insulation and flexibility, and has exce...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B05D7/14B05D7/24B05D3/02
CPCH01F41/0206H05K9/0086H01F1/22H05K9/0084B05D7/14B05D7/24B05D3/0272B05D1/18
Inventor 辛种民柳东雨李振圭
Owner LG CHEM LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products