Laminated electronic device and manufacturing method thereof

Abstract

A laminated electronic device and a method of manufacturing the same, the laminated electronic device including a laminated body including a plurality of insulator layers arranged in a stacked manner,an internal coil, a first external electrode, and a second external electrode, the laminated body having a plurality of coil patterns arranged in a stacked manner between the plurality of insulator layers, wherein the plurality of insulator layers are provided with conductive through holes, the coil patterns of adjacent layers are electrically connected through the conductive through holes to form an internal coil, the first external electrode and the second external electrode are arranged on the bottom surface of the laminated body parallel to the laminating direction, and the first externalelectrode and the second external electrode are respectively connected with two ends of the internal coil. When the laminated electronic device is subjected to patch installation, only the external electrode on the bottom surface of the laminated body needs to be connected with the welding plate, and a side tin climbing space does not need to be reserved, so that the occupied area of the patch space of the electronic device can be remarkably saved, and high-density patch of the electronic device is realized; and the structure that the internal coil is perpendicular to the bottom electrode isbeneficial to improving the Q value of the product.

Description

technical field [0001] The present application relates to electronic devices, and more specifically, to a laminated chip electronic device and a manufacturing method thereof. Background technique [0002] In recent years, with the gradual formation of wearable devices, emerging devices such as smart bracelets and Bluetooth headsets have begun to be accepted by people. Due to the small size and rich functions of this type of devices, the requirements for electronic components and electronic circuits tend to be Miniaturization and high density. [0003] With the multi-functionalization of smartphones and people's requirements for high battery life, the space left for components is gradually reduced. In order to meet customer needs, a large number of components need to be configured in a limited space, so the miniaturization of components and high-density placement of devices in a limited space are inevitable trends in future development. [0004] At present, the minimum size...

AI Technical Summary

Problems solved by technology

According to the traditional external terminal electrode structure, when the product is packaged by patch, it is necessary to reserve a space for soldering tin, which will occupy a certain amount of space on the circuit board and affect the chip density of the circuit board.

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