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A surface-emitting laser and its manufacturing method

A surface-emitting laser and low refractive index technology, which is applied in the field of semiconductor optoelectronic devices, can solve the problems of HCG-VCSEL design and production complexity, complex material growth, etc., to reduce material growth, increase single-mode output power, and increase output power. Effect

Active Publication Date: 2022-04-01
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the design and manufacture of HCG-VCSEL is also very complicated
[0004] At present, whether it is a VCSEL based on the DBR-DBR vertical cavity structure, a VCSEL based on the HCG-DBR vertical cavity structure, or a VCSEL based on the HCG-HCG vertical cavity structure, they are all based on the traditional laser working principle and need to build a laser cavity. Moreover, VCSELs containing DBR structures require complex material growth

Method used

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  • A surface-emitting laser and its manufacturing method
  • A surface-emitting laser and its manufacturing method
  • A surface-emitting laser and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] figure 1 A cross-sectional view of a surface emission laser according to an embodiment of the present disclosure is shown.

[0034] Such as figure 1 As shown, the surface emission laser includes a substrate 2, a buffer layer 3, a multilayer structure 10, a material layer 7, a photonic crystal layer 8, and a P-type electrode layer 9, which are sequentially laminated from bottom to, wherein the multilayer structure 10 includes more. A low refractive index material layer 4, a plurality of high refractive index material layers 5, an active layer 6, and the active layer 6 is located on the last layer of low refractive index material; the back surface of the substrate 2 is provided with an N-type electrode layer 1 , The buffer layer 3, the plurality of low refractive index material layers 4, the plurality of high refractive index materials 5, and the horizontal direction width of the active layer 6 are equal, the horizontal direction of the material layer 7 and the photonic crys...

Embodiment 2

[0042] Figure 5 A cross-sectional view of a surface emission laser according to another embodiment of the present disclosure is shown.

[0043] Such as Figure 5 As shown, the difference from the embodiment and the first embodiment is:

[0044] The substrate 2, the buffer layer 3, the multilayer structure 10, the material layer 7, and the horizontal direction of the photonic crystal layer 8 are equal, and the P-type electrode layer 9 is located above the photon crystal layer 8, and is a ring structure, and the photonic crystal layer 8 is The corresponding material layer 7 corresponding to the photonic crystal structure 12 is etched to form the air region 11, the horizontal direction width of the air region 11 is larger than the horizontal direction width, which is equal to the thickness of the material layer 7, wherein the photon is equal to the thickness of the material layer 7, wherein the photon The crystal layer 8 has a GaAs-based one-dimensional cycle photonic crystal structu...

Embodiment 3

[0047] Figure 8 A cross-sectional view of a surface emission laser according to another embodiment of the present disclosure is shown.

[0048] Such as Figure 8 As shown, the difference from the embodiment and the first embodiment is:

[0049] The n-type electrode layer 1 is disposed on the upper surface of the substrate 2. The N-type electrode layer 1 is disposed on the upper surface of the substrate 2 to the back surface of the substrate 2, which can achieve a coplanar electrode, reducing the parasitic effect, facilitating improving the modulation speed.

[0050] Such as Figure 9 The plan view of the surface emission laser structure of the present embodiment is, and it is understood that the n-type electrode layer 1 is a ring electrode layer, and its inside and outside diameter is greater than the side length of the square buffer layer 3, which is co-hearted with other materials.

[0051] In some embodiments of the present disclosure, if the substrate 2 is not doped, the n-type...

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Abstract

The present disclosure provides a surface-emitting laser, which is characterized in that it includes: a substrate; a multilayer structure disposed on the substrate, which includes a plurality of low-refractive index material layers, a plurality of high-refractive index material layers and an active layer , multiple low-refractive-index material layers and multiple high-refractive-index material layers are grown alternately to form a periodic or quasi-periodic Bragg mirror structure, and the active layer is located on the last grown low-refractive index material layer; wherein, the periodic The thicknesses of multiple low-refractive-index material layers and multiple high-refractive-index material layers in a periodic Bragg reflector structure are respectively equal. In a quasi-periodic Bragg reflector structure, at least one material layer has the same thickness as other material layers The thickness of the photonic crystal layer, which is provided on the multilayer structure. The present disclosure also provides a preparation method of the surface-emitting laser.

Description

Technical field [0001] The present disclosure relates to the technical field of semiconductor optoelectronic devices, and more particularly to a surface emission laser and a preparation method thereof. Background technique [0002] The vertical cavity surface emission laser (VCSEL) is configured by a substrate, a lower block mirror, an active region, an oxide layer, or a tunneling junction, a bridal mirror, a positive electrode, and a negative electrode, and the laser cavity is from the direction of growth. The upper / lower Blue Mirror (DBR) is composed of the laser, which is output in the direction of the material growth direction. Due to the unique device structure of VCSEL, it has low power consumption, fast modulation speed, small size, low cost, high reliability, circular beam, two-dimensional array integration, widely used in optical communication, optical interconnection, printing, Display, sensing, consumer electronics and other fields. [0003] The DISTRIBUTED BRAGG REF...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/11H01S5/183H01S5/065H01S5/042
CPCH01S5/18H01S5/187H01S5/065
Inventor 刘安金张靖
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI