Novel high-temperature-resistant epoxy resin adhesive as well as preparation method and use method thereof

Abstract

The invention discloses a novel high-temperature-resistant epoxy resin adhesive as well as a preparation method and a use method thereof, and relates to the technical field of novel adhesives, the novel high-temperature-resistant epoxy resin adhesive comprises the following substances in parts by mass: 8-12 parts of epoxy resin, 0.9-1.3 parts of aromatic amine high-temperature-resistant curing agent and 3-4 parts of epoxy curing agent, by adopting the processes of novel configuration, centrifugal defoaming, glue filling and the like, the produced epoxy resin glue has the advantages of high temperature resistance and no bubbles, and compared with the prior art, the patent of the invention adopts novel raw materials, a novel ratio and a novel process, tests show that the insulating propertyis excellent under different humidity and temperature, and the condition that the insulating resistance is reduced does not occur; the requirements of dielectric voltage resistance and insulation resistance of products can be met, and the application prospect is wide.

Description

technical field [0001] The invention relates to the technical field of novel adhesives, in particular to a novel high-temperature-resistant epoxy resin adhesive and a method for making and using the same. Background technique [0002] Epoxy adhesive is a liquid or solid adhesive composed of epoxy resin, curing agent, accelerator, modifier, etc. Since epoxy resin contains a variety of polar groups and highly active epoxy groups, it has strong adhesion to various polar materials such as metal, glass, cement, wood, plastics, etc. The cohesive strength is also very large, so the bonding strength is very high. Epoxy resin adhesives have been widely used in industry and life because of their excellent comprehensive properties. The development of modern science and technology such as automobiles and electronics has put forward higher requirements for the temperature resistance of adhesives. [0003] The existing epoxy adhesives cannot meet the actual use requirements when pottin...

AI Technical Summary

Problems solved by technology

[0003] The existing epoxy adhesives cannot meet the actual use requirements when potting RF connectors. There is an urgent need for high temperature resistant potting RF connectors. According to the survey results, it is known that the potting adhesives currently used in RF connectors in the industry are mainly It is E44, E-51 epoxy glue system, the epoxy glue of this system is not resistant to high temperature, and when it is stirred unevenly, there will be bubbles, and there will be unqualified insulation resistance.

In addition, the ambient temperature and humidity during potting have a great influence on the potting quality of the product. In a low temperature environment, the fluidity of epoxy glue is poor. During the mixing process, air bubbles are likely to be generated, and it is easy to cause insufficient filling during potting. , and in a higher temperature environment, the epoxy glue has a greater fluidity, and it is easy to produce glue outflow during potting