Meltallizing method of ceramic part for dry etching process

A technology of dry etching and ceramic parts, applied in the field of TFT-LCD manufacturing, can solve the problems of cost burden and high production cost, and achieve the effects of prolonging service life, improving corrosion resistance and maintaining cleanliness
CN112521183AInactive Publication Date: 2021-03-19合肥微睿科技股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
合肥微睿科技股份有限公司
Publication Date
2021-03-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a meltallizing method of a ceramic part for a dry etching process. The meltallizing method comprises the steps of firstly, putting the ceramic part to be meltallized into a soaking solution for soaking; cleaning the ceramic part with pure water and drying; shielding the ceramic part by adopting a high-temperature-resistant shielding adhesive tape and a Teflon cap, shieldinga non-meltallizing surface, and exposing the meltallizing surface; carrying out sand blasting treatment on the meltallizing surface, and then carrying out plasma spraying on the meltallizing surface;then removing the high-temperature-resistant shielding adhesive tape and the Teflon cap which shield the ceramic part, and then carrying out secondary cleaning and drying; and finally, checking the appearance and the size of the meltallizing coating. According to the method, the meltallizing coating with the required thickness can be obtained, the corrosion resistance of the ceramic part is improved, and the service life of the ceramic part is prolonged.
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Description

technical field

[0001] The invention relates to the technical field of TFT-LCD (thin film transistor liquid crystal display) manufacture, in particular to a method for spraying ceramic parts used in a dry etching process. Background technique

[0002] The dry etching (Dry Etch) process in the TFT-LCD (Thin Film Transistor Liquid Crystal Display) manufacturing process refers to removing the metal (Mo) formed on the LCD glass substrate (LCD GLASS) by plasma etching inside the vacuum chamber , Ta, Al, ITO) and insulating film (Si, SiNx) process.

[0003] Same as the upper electrode and the lower electrode, the ceramic parts installed around the lower electrode also need to be replaced regularly. The function of the ceramic parts is to protect the periphery of the lower electrode and prevent the plasma from penetrating to the bottom of the lower electrode and forming an arc. At the beginning, pure sintered ceramics were used without any coating treatment on the surface, but the...

Claims

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