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SMD solid-state capacitor and manufacturing method thereof

A manufacturing method and capacitor technology, applied in the manufacture of electrolytic capacitors, solid electrolytic capacitors, capacitors, etc., can solve the problems of adverse effects on the electrical properties of capacitors, the decrease of electrostatic capacity, and the increase of ESR, so as to improve the resistance to reflow soldering and leakage rebound, Effect of reducing loss and increasing capacitance

Pending Publication Date: 2021-03-19
ZHAOQING BERYL ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the low-temperature polymerization reaction takes a long time to complete the reaction, and under in-situ polymerization conditions, unreacted monomers, oxidants, and solvents are likely to remain in the core pack during low-temperature polymerization, which will adversely affect the electrical properties of the capacitor, such as DF The value is too large, the electrostatic capacity decreases, and the ESR increases, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of manufacturing method of SMD solid capacitor, this manufacturing method comprises the following steps:

[0023] (1) Cutting the anode foil, cathode foil and electrolytic paper into preset sizes, and fixedly connecting the anode lead and cathode lead on the anode foil and cathode foil; winding the anode foil, electrolytic paper and cathode foil into a core package;

[0024] (2) performing chemical conversion treatment on the core pack to repair the oxide film on the surface of the anode foil;

[0025] (3) Impregnated with a pretreatment agent and dried; the pretreatment agent is a mixed solution of a surfactant and a silane coupling agent;

[0026] (4) Impregnation with dispersion liquid: ① The core in step (3) is soaked in monomer solution and dried; ② Impregnation with oxidant;

[0027] (5) forming a conductive polymer in the core pack by staged and time-divided heating and polymerization; specifically,

[0028] The step-by-step heating polymerization refers...

Embodiment 2

[0031] The difference between this example and Example 1 is that the staged and time-divided heating polymerization refers to heating at 45°C for 55 minutes, heating at 55°C for 85 minutes, heating at 65°C for 95 minutes, heating at 75°C for 25 minutes, heating at 145°C for 35 minutes, and heating at 170°C. Heating for 10 minutes, heating at 175°C for 20 minutes, and heating at 215°C for 5 minutes.

Embodiment 3

[0033] The difference between this example and Example 1 is that the staged and time-divided heating polymerization refers to heating at 35°C for 65 minutes, heating at 45°C for 95 minutes, heating at 55°C for 85 minutes, heating at 65°C for 35 minutes, heating at 155°C for 25 minutes, and heating at 160°C. Heating for 20min, heating at 185°C for 10min, heating at 205°C for 10min.

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PUM

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Abstract

The invention discloses an SMD solid-state capacitor and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a core package by an anode foil, a cathode foiland electrolytic paper; then carrying out impregnation treatment of dispersion liquid on the core cladding; forming a conductive polymer within the core package by segmented time-sharing heating polymerization; assembling, sealing and aging the polymerized core cladding; wherein the segmented time-sharing heating polymerization refers to heating for 55-65 minutes at 35-45 DEG C, heating for 85-95minutes at 45-55 DEG C, heating for 85-95 minutes at 55-65 DEG C, heating for 25-35 minutes at 65-75 DEG C, heating for 25-35 minutes at 145-155 DEG C, heating for 10-20 minutes at 160-170 DEG C, heating for 10-20 minutes at 175-185 DEG C and heating for 5-15 minutes at 205-215 DEG C. According to the manufacturing method, specific segmented time-sharing heating polymerization is adopted, compared with the same specification and size, the impregnation capacity extraction rate is increased, the problems of reflow soldering resistance and electric leakage recovery of the solid-state capacitor can be obviously solved, damage of high-temperature treatment to an oxidation film of the capacitor can be avoided, meanwhile, the service life of the product is not affected. And the electrostatic capacity is obviously improved, and the loss DF value and the impedance ESR are effectively reduced.

Description

technical field [0001] The invention relates to the technical field of electrolytic capacitors, in particular to an SMD solid capacitor and a manufacturing method thereof. Background technique [0002] Solid capacitors have the advantages of low ESR, good high-frequency characteristics, and miniaturization. They are more and more widely used in the current market, especially in today's rapid development of the electronics industry. Various high-end power supplies and electronic products have more and more requirements for capacitors. The higher the value, the greater the application prospects of solid capacitors. Compared with plug-in solid capacitors, SMD solid capacitors can improve the production efficiency of electronic products, realize large-scale automated production, and save manpower and time. The urgent demand will surely stimulate the rapid development of the market of SMD solid capacitors, and the prospect is very broad. At present, the main suppliers of SMD so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/00H01G9/15H01G13/04
CPCH01G9/0036H01G9/151H01G13/04
Inventor 陈桃桃刘泳澎伍小军
Owner ZHAOQING BERYL ELECTRONICS TECH