A kind of pcb ultra-high aspect ratio mechanical drilling processing method
A technology of mechanical drilling and processing methods, applied in the directions of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of signal loss failing to achieve high-speed transmission, poor processing quality, etc., and achieve fast processing efficiency and reduce signal loss. Effect
Active Publication Date: 2022-05-17
广州广合科技股份有限公司
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[0005] Aiming at the deficiencies of the prior art, the present invention proposes a PCB ultra-high aspect ratio mechanical drilling processing method, and the hole position accuracy, hole wall quality, hole shape, hole blocking rate, knife breaking rate, and hole deviation all meet the requirements. Microholes with ultra-high aspect ratios overcome the defect of poor processing quality of microholes with ultra-high aspect ratios that lead to signal loss and fail to achieve high-speed transmission
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Embodiment 1
[0026] A PCB ultra-high aspect ratio mechanical drilling processing method, the method adopts a three-step sub-drilling method to perform mechanical drilling to process micro-holes, and the specific processing method is as follows:
[0027] Please refer to figure 1 , step (1), first put a layer of backing plate 1 on the processing platform, the backing plate 1 is a melamine backing plate, and then place the PCB board 2 that needs to be processed and drilled on the melamine backing plate, The S side of the PCB board, that is, the solder side faces the melamine backing board, while the C side of the PCB board 2, that is, the component side faces upward. Then, place the coated aluminum sheet 3 on the C surface of the PCB board 2 . Ready for mechanical drilling. The thickness of the PCB board 2 is 4.6mm.
[0028] Step (2), use a drill bit with a blade length of 3.0mm and a diameter of 0.20mm to move the knife from top to bottom, the feed speed is F0, the speed is S0, and the dr...
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The invention discloses a PCB ultra-high aspect ratio mechanical drilling processing method, which uses a three-step sub-drilling method to perform mechanical drilling to process micro-holes. The three-step sub-drilling method includes: using a drill bit with a blade length of 3.0mm Cut the knife from the C side of the PCB board, the feed speed is F0, the speed is S0, the drilling depth is 2.0~3.0mm; use a drill with a blade length of 4.5mm to cut the knife from the C side of the PCB board, the feed speed is F1, The rotation speed is S1, and the drilling depth is 3.0-4.0mm; use a drill bit with a blade length of 6.0mm to drill from the C side of the PCB board, the feed speed is F1, the rotation speed is S1, and the PCB is drilled through. The microholes prepared by the present invention can meet the requirement of 1.33 process ability no matter the hole position accuracy in X direction or the hole position in Y direction. All meet the drilling quality requirements, and the processing efficiency is fast.
Description
technical field [0001] The invention relates to the technical field of PCB processing, in particular to a method for mechanically drilling a PCB with an ultra-high aspect ratio. Background technique [0002] With the application of 5G technology, the demand for transmission capacity is increasing year by year. In the future, the requirements for signal transmission capabilities of high-speed products will become higher and higher, and the corresponding market demand will also increase year by year. In the 5G era, the optical communication rate will be increased to 25G, and the mainstream product will be 25G high-speed optical chips. At present, the improvement of data pipeline capabilities under the application of big data environment has begun to lay out. Has begun to apply capacity expansion and speed-up to design the next generation of high-speed PCB products, which doubles the speed of current 25G products, including single boards (LC / HDI / server), backplanes (including ...
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IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 黎钦源王平张志超刘锡明徐远征王振甲
Owner 广州广合科技股份有限公司