Baking device for system-level integrated circuit manufacturing and using method thereof

Abstract

The invention discloses a baking device for system-level integrated circuit manufacturing and a using method thereof. The baking device comprises a baking box body, wherein a drying mechanism is fixedly mounted at the top of the baking box body. According to the scheme, the placed integrated circuit board can be pressed downwards through a pressing mechanism composed of a pressing plate, a slidingrod, a telescopic column and a moving block, the situation that the integrated circuit board topples over is avoided, and the stability of the integrated circuit board is improved. Meanwhile, moisture evaporated from the integrated circuit board is pumped into an inner cavity of the drying mechanism through the drying mechanism during baking, the integrated circuit board is dried through an anhydrous calcium chloride dry cotton filling block and then fed into the inner cavity of the baking box body to complete drying, the situation that the baked moisture is accumulated in the inner cavity ofthe baking box body is avoided, cold air in the external environment can be sucked in, and cold air is filtered, exchanged and dried and then blown into the inner cavity of the box body, so that cooling of the integrated circuit board is accelerated.

Description

technical field [0001] The invention relates to the technical field of integrated circuit board manufacturing, in particular to a baking device for system-level integrated circuit manufacturing and a method for using the same. Background technique [0002] An integrated circuit board is a carrier for carrying integrated circuits. But it is often said that the integrated circuit board also brings the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board uses semiconductor manufacturing technology to manufacture many transistors, resistors, capacitors and other components on a small single crystal silicon chip, and combines the components into a complete circuit board according to the method of multi-layer wiring or tunnel wiring. electronic circuit. It is represented by the letter "IC" (also with the text symbol "N", etc.) in the circuit [0003] Baking can eliminate the internal stress of...

AI Technical Summary

Problems solved by technology

Disadvantages of baking: the color of the PCB board may change, affecting the appearance

[0004] In the production process of integrated circuit boards, it is necessary to use a baking device to bake the integrated circuit boards. However, the traditional baking devices cannot compress and fix the integrated circuit boards, and the circuit boards are easy to fall, resulting in damage to the integrated circuit boards. During the baking process, the moisture inside the baking device cannot be removed in time, resulting in a large amount of water vapor still existing after the baking is completed, and the integrated circuit board is usually cooled by natural cooling after the baking is completed, and the cooling efficiency is low

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