Plastic materials with high bonding strength for plastic-metal hybrid applications
A technology of mixed materials and bonding strength, applied in the field of plastic materials, can solve problems such as weak acid resistance, high cost, and impractical use
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example 1
[0113] Example 1 - Evaluation of bond strength and impact strength
[0114] The bonding strength given according to the nano-molding technique of the nano-dielectric resin material was evaluated. The material tested is a conventional non-epoxy plastic composition, or an epoxy-based composition according to the present invention. Table 2 lists the materials for forming corresponding resins:
[0115] Table 2
[0116]
[0117] In order to form a resin, a WERNER & PFLEIDER extruder ZSK 25 mm (mm) is used to rotate twin screw over 300 revolutions per hour (kilogram / hour) and 300 revolutions per hour (rpm). The material of each corresponding resin is processed. The residence time in the extruder is less than 30 seconds. Unless otherwise stated, it is then molded using Sumitomo SE180EV to mold the compound of the compound under the conditions indicated in Table 3 below.
[0118] table 3
[0119]
[0120] Using the bond tool to model the components on bond strength and darts impact....
example 2
[0133] Example 2 - Evaluation of color changes
[0134] The color change after the molded sample after the anode is evaluated. Table 7 describes the results of the evaluation of samples Ce1, E2, E4, and E5, initially described in Example 1. Rendering the value of the color coordinates.
[0135] Table 7
[0136] ΔE ΔL Δa ΔB CE1 5.43 -0.35 -0.36 5.41 E2 2.84 -0.92 -0.79 2.57 E4 6.35 -0.48 -0.73 6.29 E5 2.57 1.06 -0.54 2.28
[0137] Table 7 shows that the ΔE variation of the samples E2 and E5 of the present invention is much smaller than the ΔE change observed for CE1. Therefore, the epoxy-based composition is minimized after the epoxy composition is minimized compared to conventional PBT-based compositions.
example 3-
[0138] Example 3 - Evaluation of Performance after an increased residence time
[0139] The sample E4 was tested to determine the effect of bonding intensity imparted by the sample when the residence time in the injection molding apparatus increased. The test condition contains a cylinder temperature of 265 ° C and a mold temperature of 155 ° C. Table 8 provides the results of the assessment.
[0140] Table 8
[0141] Sayment time (minutes) 0 3 5 Key intensity (MPA) 32.25 32.22 30.67
[0142] The assessment was revealed, even after five minutes of residence time (compared to the non-residence time in the original example), the bonding strength is basically consistent.
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