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Liquid epoxy composite for packaging semiconductor and its application

A technology of liquid epoxy resin and composition, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve problems such as high viscosity, high thermal expansion coefficient, and poor fluidity

Inactive Publication Date: 2003-10-22
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to overcome the shortcomings of high viscosity, poor fluidity, low glass transition temperature and high thermal expansion coefficient, and provide a kind of composite material with excellent comprehensive properties such as low viscosity, high fluidity, low thermal expansion, high glass transition temperature and good toughness. liquid epoxy composition

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 100 parts by weight of 4,5-epoxyhexane-1,2 dicarboxylic acid diglycidyl ester, 123 parts by weight of methyl hexahydrophthalic anhydride, 0.5 parts by weight of 2-methylimidazole, 0.3 parts by weight of γ -Aminopropyltriethoxysilane, 380 parts by weight of fused spherical silica, 0.5 parts by weight of polydimethylsiloxane and 1.0 parts by weight of carbon black were prepared by kneading for 15 minutes at 25°C using a three-roller mill, The properties are shown in Table 3.

Embodiment 2

[0033] 65 parts by weight of 4,5-epoxyhexane-1,2-dicarboxylic acid diglycidyl ester, 35 parts by weight of 3,4 epoxy cyclohexane carboxylic acid 3,4-epoxy cyclohexyl methyl ester, 115 Parts by weight of methyltetrahydrophthalic anhydride, 0.6 parts by weight of 2-ethyl-4-methylimidazole, 0.5 parts by weight of γ-aminopropyltriethoxysilane, 411 parts by weight of fused spherical silica, 95 parts by weight of fused angular silica, 1.2 parts by weight of polydimethylsiloxane and 0.9 parts by weight of carbon black were prepared by kneading at 25°C for 15 minutes using a three-roller mill. The properties are shown in Table 3.

Embodiment 3

[0035]75 parts by weight of 4,5-epoxyhexane-1,2-dicarboxylic acid diglycidyl ester, 25 parts by weight of 3,4 bisphenol A diglycidyl ether, 68 parts by weight of methyl tetrahydrophthalo acid anhydride, 64 parts by weight of methylhexahydrophthalic anhydride, 1.0 parts by weight of iron acetylacetonate, 1.0 parts by weight of γ-aminopropyltriethoxysilane, 555 parts by weight of fused spherical silica and 5.0 parts by weight of Polydimethylsiloxane and 2.7 parts by weight of carbon black were mixed at 25° C. for 15 minutes in a three-roll mill, and the properties are shown in Table 3.

[0036] The composition and content of the compositions of Examples 4-14 and Comparative Example are shown in Table 1-2, and the preparation method is the same as that of Examples 1-3.

[0037] Example

[0038] Example

[0039] Example

[0040] It can be seen from Table 1 that the viscosity of the liquid epoxy resin composition prepared by the present invention...

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PUM

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Abstract

The present invention discloses a liquid epoxy resin composite for packaging semiconductor, including (by weight portion) 100 portions of liquid epoxy resin, 65-165 portions of anhydride solidifying agent, 0.5-5.0 portions of solidification accelerating agent, 0.3-1.0 portion of silane coupling agent and 380-950 portions of inorganic filler, in which the described liquid epoxy resin is selected from one or several kinds of 3,4-epoxycyclohexanecar-boxylic acid, 3,4-epoxycyclohexylmethyl ester, 4,5-epoxyhexane-1,2 diformate diglycidic ester and bisphenol diglycidyl ether. Said composite possesses low viscosity and high fluidity, and the solidified product possesses good toughness.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a liquid epoxy resin composition for semiconductor encapsulation. Background technique [0002] Due to the demand for electronic products such as wireless communications and portable computers, integrated circuits are increasingly becoming smaller, lighter, and thinner, and the packaging density is getting higher and higher. Adapting to this development trend, the packaging form of integrated circuits is changing from traditional dual in-line (DIP) and quad flat (QFP) packaging to flip-chip ball grid array (FC-PBGA), chip size ( CSP), Direct Die Attach (DCA), and Multi-Chip Module (MCM) variations. Most of the materials used in these new packaging forms are liquid epoxy packaging materials. [0003] The main performance requirements of the new liquid epoxy encapsulant are low viscosity and good fluidity, especially for FC-PBGA packaging, which is to pot the liquid epoxy encapsulant...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C09K3/10H01L23/29
Inventor 王忠刚谢美然陶志强
Owner INST OF CHEM CHINESE ACAD OF SCI