Moderate-temperature-curing latent epoxy resin curing agent

An epoxy resin curing and epoxy resin technology, applied in the field of medium-temperature curing latent epoxy resin curing agent, can solve the problems of not meeting the preparation cycle, short storage period at room temperature, high curing temperature, etc., and achieve good lap shear strength and the effect of tensile strength

Inactive Publication Date: 2021-03-30
SHAANXI SCI TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the imidazole-based epoxy resin system has a short storage period at room temperature, which cannot meet the preparation cycle required by many production fields; the curing temperature of the dicyandiamide-based epoxy resin system is relatively high, and many materials cannot withstand such a temperature, which limits its application.

Method used

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  • Moderate-temperature-curing latent epoxy resin curing agent
  • Moderate-temperature-curing latent epoxy resin curing agent
  • Moderate-temperature-curing latent epoxy resin curing agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A medium temperature curing latent epoxy resin system, the components of the medium temperature curing latent epoxy resin system are shown in the following table:

[0016] Table 1 Component list of medium temperature curing latent epoxy resin system in Example 1

[0017]

[0018] The preparation method of concrete implementation described middle temperature curing latent type epoxy resin system is carried out according to the following steps:

[0019] (1) Weigh bisphenol A epoxy resin E51, high temperature curing agent, stabilizer and nano silicon dioxide according to the parts by mass described in Table 1.

[0020] (2) Mix the raw materials weighed in step (1) at room temperature.

[0021] (3) Add the modified curing agent polyetheramine in the number of parts by mass in Table 1 to the mixture obtained by stirring in step (2) for blending, place it in a planetary mixer, set the speed at 1800 rpm, and rotate to stir 30 seconds to obtain a medium temperature curing ...

Embodiment 2

[0023] A medium temperature curing latent epoxy resin system, the components of the medium temperature curing latent epoxy resin system are shown in the following table:

[0024] Table 2 Component list of medium temperature curing latent epoxy resin system in Example 2

[0025]

[0026] The preparation method of the medium-temperature curing latent epoxy resin system is the same as that of Example 1.

Embodiment 3

[0028] A medium temperature curing latent epoxy resin system, the components of the medium temperature curing latent epoxy resin system are shown in the following table:

[0029] Table 3 Component list of medium temperature curing latent epoxy resin system in Example 3

[0030]

[0031] The preparation method of the medium-temperature curing latent epoxy resin system is the same as that of Example 1.

[0032] The following table shows the performance parameters of the medium-temperature curing latent epoxy resin system prepared in Examples 1-3 of the present invention.

[0033]

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Abstract

The invention relates to the field of epoxy resin curing agents, in particular to a moderate-temperature-curing latent epoxy resin curing agent. The curing agent comprises the following components inparts by mass: 100 parts of a resin main body, 5-15 parts of a high-temperature curing agent, 1-5 parts of a modified curing agent, 0-2 parts of a stabilizer and 5-10 parts of a nano-filler. The selected modified curing agent has a good room-temperature storage period on the premise of realizing moderate-temperature (100-120 DEG C) curing; the addition of the stabilizer and the nano-filler can achieve a good toughening effect, the nano-filler can also reduce the thermal expansion coefficient of an adhesive, and the stabilizer plays an important role in prolonging the room-temperature storage period; and besides, the high-temperature curing agent and the modified curing agent are used in cooperation according to a certain ratio, so an epoxy resin curing system has a certain proportion of flexible chain segments while having high cross-linked network density, and the cured system has good Al-Al lap shear strength and tensile strength.

Description

technical field [0001] The invention relates to the field of epoxy resin curing agents, in particular to a medium-temperature curing latent epoxy resin curing agent. Background technique [0002] Epoxy resin is a general term for oligomers containing not less than two epoxy rings in a molecule. Such oligomers are usually capable of forming thermoset products through ring-opening reactions. Due to its excellent adhesive properties, corrosion resistance, mechanical properties, electrical properties and other advantages, epoxy resin is widely used in national production and life, even in automobile manufacturing, aerospace and other fields. Epoxy resin itself usually has a molecular weight of less than 2,000 and does not have a three-dimensional network structure. It is a thermoplastic material that does not have excellent physical, mechanical and chemical properties and cannot be used directly; Under conditions such as light and pressure, the low-molecular-weight epoxy resin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/26C08K3/26C08G59/50
CPCC08K7/26C08K3/26C08G59/504C08G59/5073C08G59/5006C08K2201/011C08K2003/265
Inventor 丁镠郝晓丽李培友邓志峰
Owner SHAANXI SCI TECH UNIV
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