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Vacuum magnetic control mobile phone rear shell coating process

A mobile phone back shell and mobile phone shell technology, which is applied in vacuum evaporation coating, metal material coating process, sputtering coating, etc., can solve the problem of reducing the quality of the magnetron sputtering coating on the back shell of the mobile phone and unfavorable use of the coating on the back shell of the mobile phone , Affect the coating effect of the back shell of the mobile phone, etc., to achieve the effect of improving the coating effect, eliminating stress, and improving the bonding force

Inactive Publication Date: 2021-04-02
苏州市三同电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing vacuum magnetic control mobile phone back shell coating process is not convenient to detect the gas environment in the vacuum chamber during the coating process of the mobile phone back shell, which affects the coating effect on the mobile phone back shell, and it is not convenient to detect impurities in the target material. Carry out cleaning, reduce the coating quality of magnetron sputtering to the mobile phone rear case, be unfavorable for the coating use of mobile phone rear case, for this reason, propose a kind of vacuum magnetron mobile phone rear case coating process

Method used

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  • Vacuum magnetic control mobile phone rear shell coating process

Examples

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Effect test

Embodiment 1

[0028] see figure 1 , the present invention provides a technical solution: a coating process for the back shell of a vacuum magnetron mobile phone, comprising the following steps:

[0029] S1. Clean the back shell of the mobile phone;

[0030] S2, heating and drying the back shell of the mobile phone;

[0031] S3, move the back shell of the mobile phone into the vacuum chamber;

[0032] S4, removing the oxide film on the target by ion bombardment;

[0033] S5. Carry out sputter coating on the back shell of the mobile phone;

[0034] S6, monitoring the flow of argon;

[0035] S7, inspecting the surface of the mobile phone rear shell;

[0036] S8, packing the mobile phone case.

[0037] In this embodiment, specifically: in S1, put the back shell of the mobile phone into the cleaning equipment, and clean the dirt and impurities on the surface of the back shell of the mobile phone. The cleaning time is 10 minutes, and the temperature of the cleaning water is 50°C; The rear ...

Embodiment 2

[0046] see figure 1 , the present invention provides a technical solution: a coating process for the back shell of a vacuum magnetron mobile phone, comprising the following steps:

[0047] S1. Clean the back shell of the mobile phone;

[0048] S2, heating and drying the back shell of the mobile phone;

[0049] S3, move the back shell of the mobile phone into the vacuum chamber;

[0050] S4, removing the oxide film on the target by ion bombardment;

[0051] S5. Carry out sputter coating on the back shell of the mobile phone;

[0052] S6, monitoring the flow of argon;

[0053] S7, inspecting the surface of the mobile phone rear shell;

[0054] S8, packing the mobile phone case.

[0055]In this embodiment, specifically: in S1, put the back shell of the mobile phone into the cleaning equipment, and clean the dirt and impurities on the surface of the back shell of the mobile phone. The cleaning time is 15 minutes, and the temperature of the cleaning water is 55°C; The rear c...

Embodiment 3

[0064] see figure 1 , the present invention provides a technical solution: a coating process for the back shell of a vacuum magnetron mobile phone, comprising the following steps:

[0065] S1. Clean the back shell of the mobile phone;

[0066] S2, heating and drying the back shell of the mobile phone;

[0067] S3, move the back shell of the mobile phone into the vacuum chamber;

[0068] S4, removing the oxide film on the target by ion bombardment;

[0069] S5. Carry out sputter coating on the back shell of the mobile phone;

[0070] S6, monitoring the flow of argon;

[0071] S7, inspecting the surface of the mobile phone rear shell;

[0072] S8, packing the mobile phone case.

[0073] In this embodiment, specifically: in S1, put the back case of the mobile phone into the cleaning equipment, and clean the dirt and impurities on the surface of the back case of the mobile phone. The cleaning time is 20 minutes, and the temperature of the cleaning water is 60°C; The rear ca...

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Abstract

The invention discloses a vacuum magnetic control mobile phone rear shell coating process. The process comprises the following steps of S1, cleaning a mobile phone rear shell; S2, heating and drying the mobile phone rear shell; S3, moving the mobile phone rear shell into a vacuum chamber; S4, removing an oxide film on a target material through ion bombardment; S5, performing sputter coating on themobile phone rear shell; S6, monitoring the flow of argon; S7, inspecting the surface of the mobile phone rear shell; and S8, packaging the mobile phone rear shell. According to the vacuum magnetic control mobile phone rear shell coating process, the gas environment in the vacuum chamber is detected through mass spectrometry equipment, so that the flow of the argon in the vacuum chamber is conveniently controlled in real time, the coating effect on the mobile phone rear shell is improved, meanwhile, ion bombardment is conducted on the target material, and oxide and impurities on the surface of the target material are removed, so that the magnetron sputtering coating quality of the mobile phone rear shell is improved, and the coating use of the mobile phone rear shell is facilitated.

Description

technical field [0001] The invention relates to the technical field of coating, in particular to a coating process for a vacuum magnetron mobile phone rear case. Background technique [0002] Magnetron sputtering is a type of physical vapor deposition. The general sputtering method can be used to prepare multiple materials such as metals, semiconductors, and insulators, and has the advantages of simple equipment, easy control, large coating area and strong adhesion. The magnetron sputtering method has achieved high speed, low temperature and low damage. Because high-speed sputtering is performed under low pressure, the ionization rate of the gas must be effectively increased. Magnetron sputtering introduces a magnetic field on the surface of the target cathode, and uses the magnetic field to confine the charged particles to increase the plasma density to increase the sputtering rate. Magnetron sputtering is a physical vapor deposition phenomenon. Mobile phone cases are bec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/54C23C14/02
CPCC23C14/35C23C14/54C23C14/544C23C14/022
Inventor 罗伟张汐
Owner 苏州市三同电子科技有限公司
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