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Infrared thermal pile sensor and manufacturing method thereof

A manufacturing method and infrared heat technology, which are applied in the field of infrared temperature measurement, can solve problems such as poor integration of thermistors, and achieve the effects of mass production, good integration, and miniaturization.

Pending Publication Date: 2021-04-06
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention discloses an infrared thermopile sensor and its manufacturing method, which can solve the problem of poor integration of thermopile structure and thermistor

Method used

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  • Infrared thermal pile sensor and manufacturing method thereof
  • Infrared thermal pile sensor and manufacturing method thereof
  • Infrared thermal pile sensor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This embodiment provides an infrared thermal pile sensor, figure 1 It shows a schematic structural diagram of an infrared thermopile sensor according to this embodiment, please refer to figure 1 , the infrared thermopile sensor includes:

[0032] Carrier substrate 10;

[0033] Thermopile structure 20 (shown in the rectangular dotted line box), described thermopile structure 20 is arranged on the top of described carrying substrate 10, and described thermopile structure 20 comprises the isolation layer 26 that is positioned on carrying substrate 10, consists of at least one set The thermopile main body 21 (shown in the ellipse frame) that thermocouple pair constitutes, described thermopile main body 21 is used for receiving infrared radiation; In the present embodiment, the upper surface of thermopile main body 21 is covered with absorption layer 25, and absorption layer 24 Can better absorb infrared radiation.

[0034] The thermistor 11 is arranged on the lower surfa...

Embodiment 2

[0047] Embodiment 2 provides a kind of manufacturing method of infrared thermopile sensor, comprises the following steps:

[0048] S01: providing a carrier substrate, the carrier substrate has an opposite first surface and a second surface;

[0049] S02: Form a thermopile structure on the first surface of the carrier substrate, the thermopile structure includes a thermopile body composed of at least one set of thermocouple pairs, and the thermopile body is used to receive infrared radiation;

[0050] S03: Forming a thermistor in the carrying substrate or on the second surface of the carrying substrate.

[0051] Step SON does not represent a sequence.

[0052] It should be noted that forming the thermistor in the carrier substrate includes: 1. The thermistor is entirely wrapped in the carrier substrate or the lower surface of the thermistor is buried in the carrier substrate, and the upper surface is flush with the carrier substrate. Forming the thermistor on the second surfa...

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PUM

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Abstract

The invention provides an infrared thermal pile sensor and a manufacturing method thereof, and the infrared thermal pile sensor comprises: a bearing substrate; a thermopile structure which is arranged above the bearing substrate, wherein the thermopile structure comprises a thermopile main body, the thermopile main body is composed of at least one group of thermocouple pairs, and the thermopile main body is used for receiving infrared radiation; and a thermistor which is arranged on the lower surface of the bearing substrate or buried in the bearing substrate, wherein the thermistor is located on the outer side of the thermal reactor main body. According to the infrared thermopile sensor, the thermistor is arranged on the lower surface of the bearing substrate or buried in the bearing substrate, the thermopile structure is formed on the bearing substrate, the thermopile structure and the thermistor are arranged on the same bearing substrate, better integration of the thermistor and the thermopile can be achieved, and the requirement for miniaturization is met.

Description

technical field [0001] The invention relates to the field of infrared temperature measurement, in particular to an infrared thermal pile sensor and a manufacturing method thereof. Background technique [0002] Among the wide range of sensors, temperature sensors are second to none in terms of application fields and quantity. With the development of modern electronic technology, temperature sensors have been widely used in industrial technology, scientific research and daily life. Temperature sensors with thermopiles as temperature sensing elements are widely used in temperature measurement, control and other fields. As the demand for temperature control in various industries is becoming more and more strict and precise, the requirements for product reliability are more stringent, the volume requirements are smaller, the sensitivity requirements are higher, and the installation and use requirements are more convenient. [0003] Currently manufactured infrared thermopile sens...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/16H01L35/32H01L35/34G01J5/20H10N19/00H10N10/01H10N10/17
CPCG01J5/20H10N19/00H10N10/01H10N10/17
Inventor 韩凤芹
Owner NINGBO SEMICON INT CORP