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Antenna, antenna packaging method and terminal

An encapsulation method and antenna technology, which are applied in the directions of antenna support/installation device, antenna grounding switch structure connection, radiation element structure form, etc., can solve the problems affecting antenna gain and high dielectric loss, and achieve high antenna gain and dielectric loss. The effect of low loss, increased gain and bandwidth

Active Publication Date: 2022-06-28
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the use of plastic encapsulant as the antenna medium has high dielectric loss, which affects the antenna gain

Method used

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  • Antenna, antenna packaging method and terminal
  • Antenna, antenna packaging method and terminal
  • Antenna, antenna packaging method and terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] figure 1 It is a structural representation of the antenna provided in Embodiment 1 of this application Figure 1 ,refer to figure 1 As shown, the antenna provided by Embodiment 1 of the present application includes a first glass substrate 11 , a first antenna layer 12 , a second antenna layer 13 , a first encapsulation layer 14 , a second encapsulation layer 15 and a first metal connection post 16 .

[0067] Wherein, the first glass substrate 11 is a plate structure made of glass, the first glass substrate 11 includes a first surface and a second surface oppositely arranged, and the first surface is figure 1 The lower surface of the first glass substrate 11 is shown, and the second surface is figure 1 The upper surface of the first glass substrate 11 is shown. The first glass substrate 11 is used as the antenna medium, and its thickness is 150 μm-800 μm, which can reduce the thickness of the medium compared to using the plastic encapsulant as the antenna medium.

[...

Embodiment 2

[0099] Figure 11 is a schematic structural diagram of the antenna provided in Embodiment 2 of the present application, refer to Figure 11 As shown, the antenna provided in Embodiment 2 of the present application includes: a first glass substrate 11, a first antenna layer 12, a second antenna layer 13, a first encapsulation layer 14, a second encapsulation layer 15, a first metal connection post 16, The radio frequency chip 17 , the second metal connection post 18 , the third package layer 19 , the solder bump 20 , the second glass substrate 23 , the third antenna layer 24 and the fourth package layer 25 .

[0100] Wherein, the first glass substrate 11 and the second glass substrate 23 are plate-shaped structures made of glass, the first glass substrate 11 includes a first surface and a second surface oppositely arranged, and the first surface is Figure 11 The lower surface of the first glass substrate 11 is shown, and the second surface is Figure 11 The upper surface of ...

Embodiment 3

[0125] Embodiment 3 of the present application provides a terminal, including: a circuit board and the antenna provided in Embodiment 1 or 2 above, where the antenna is connected to the circuit board. Wherein, the terminal equipment involved in Embodiment 3 of the present application may include mobile phones, watches, tablet computers, personal digital assistants (Personal Digital Assistant, PDA), sales terminals (Point of Sales, POS), vehicle-mounted computers and other electronic equipment.

[0126] The terminal provided in Embodiment 3 of the present application includes the antenna provided in Embodiment 1 or Embodiment 2 above, so it also has the advantages described in Embodiment 1 or Embodiment 2 above. For details, please refer to the relevant description above, which will not be repeated here. repeat.

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PUM

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Abstract

The present application provides an antenna, an antenna packaging method, and a terminal. The antenna includes: a first glass substrate, a first antenna layer, a second antenna layer, a first packaging layer, a second packaging layer, and a first metal connecting column; The first glass substrate includes a first surface and a second surface oppositely arranged, a first antenna layer is arranged on the first surface, a second antenna layer is arranged on the second surface, and the first encapsulation layer covers the The first surface and the first antenna layer, the second encapsulation layer covers the second surface and the second antenna layer; the first accommodating groove is arranged in the first accommodating groove, and the first accommodating groove An insulator is provided, the first metal connection post is disposed in the insulator, and both ends of the first metal connection post are respectively connected to the first antenna layer and the second antenna layer. In the antenna, antenna packaging method and terminal provided by the present application, glass is used as the antenna medium, which has low dielectric loss and good antenna performance.

Description

technical field [0001] The present application relates to the field of packaging and the technical field of communication equipment, and in particular to an antenna, an antenna packaging method, and a terminal. Background technique [0002] With the advent of the era of high-speed communications such as 5G and virtual reality, there are more and more applications and designs of millimeter wave antennas. Since the wavelength of the millimeter-wave frequency band is extremely small, the sensitivity to processing errors is very high. Therefore, high-precision technology is used to manufacture millimeter-wave antennas, such as antennas in packages (Antenna in package, referred to as AIP). [0003] The packaged built-in antenna includes an antenna and a radio frequency chip. The antenna includes an upper antenna layer, a lower reference ground layer, and a feeder connected to the upper antenna layer. The feeder is connected to the radio frequency chip, and the radio frequency chi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/22H01Q1/36H01Q1/38H01Q1/50
CPCH01Q1/22H01Q1/36H01Q1/38H01Q1/50
Inventor 于睿张湘辉
Owner HUAWEI TECH CO LTD