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Nano silver powder conductive adhesive with good conductivity

A technology of nano silver powder and conductive adhesive, applied in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve problems such as poor electrical conductivity, and achieve the effect of improving electrical conductivity and reducing contact resistance.

Inactive Publication Date: 2021-04-30
江仁燕
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a nano-silver powder conductive adhesive with good conductivity to solve the technical problem that the current nano-silver powder conductive adhesive has poor electrical conductivity while meeting high-density connections.

Method used

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  • Nano silver powder conductive adhesive with good conductivity
  • Nano silver powder conductive adhesive with good conductivity

Examples

Experimental program
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Effect test

Embodiment 1

[0023] The nano-silver powder conductive adhesive includes the following raw materials in parts by weight: 100g of epoxy resin E-51 matrix resin, 98g of methyl hexahydrophthalic anhydride (MeHHPA) curing agent, 0.67g of 2-ethyl- 4-methylimidazole (2E4MZ) curing accelerator, composite self-sintering surfactant composed of 3g of benzyltriethylammonium chloride and 2g of tetrabutylammonium hydrogensulfate, 140g of silver powder with an average particle size ≤ 100nm Conductive filler, 1g of malonic acid conduction accelerator, 2g of r-aminopropyltriethoxysilane coupling agent, 1g of phenylhydroquinone antioxidant, 2g of silicone compound defoamer;

[0024] The preparation method of above-mentioned nano-silver powder conductive adhesive comprises the following steps:

[0025] Step 1: Weigh 100g of epoxy resin E-51 base resin, 98g of methylhexahydrophthalic anhydride (MeHHPA) curing agent, and 0.67g of 2-ethyl-4-methylimidazole (2E4MZ) in sequence Put the curing accelerator into th...

Embodiment 2

[0030] The nano-silver powder conductive adhesive includes the following raw materials in parts by weight: 100g of epoxy resin E-51 matrix resin, 98g of methyl hexahydrophthalic anhydride (MeHHPA) curing agent, 0.67g of 2-ethyl- 4-Methylimidazole (2E4MZ) curing accelerator, composite self-sintering surfactant composed of 1g of benzyltriethylammonium chloride and 4g of tetrabutylammonium hydrogensulfate, 150g of silver powder with an average particle size ≤ 100nm Conductive filler, 1g of malonic acid conduction accelerator, 2g of r-aminopropyltriethoxysilane coupling agent, 1g of phenylhydroquinone antioxidant, 2g of silicone compound defoamer;

[0031] The preparation method of above-mentioned nano-silver powder conductive adhesive comprises the following steps:

[0032] Step 1: Weigh 100g of epoxy resin E-51 base resin, 98g of methylhexahydrophthalic anhydride (MeHHPA) curing agent, and 0.67g of 2-ethyl-4-methylimidazole (2E4MZ) in sequence Put the curing accelerator into th...

Embodiment 3

[0037] The nano-silver powder conductive adhesive includes the following raw materials in parts by weight: 100g of epoxy resin E-51 matrix resin, 98g of methyl hexahydrophthalic anhydride (MeHHPA) curing agent, 0.67g of 2-ethyl- 4-methylimidazole (2E4MZ) curing accelerator, composite self-sintering surfactant composed of 3g of benzyltriethylammonium chloride and 1g of tetrabutylammonium hydrogensulfate, 165g of silver powder with an average particle size ≤ 100nm Conductive filler, 1g of malonic acid conduction accelerator, 2g of r-aminopropyltriethoxysilane coupling agent, 1g of phenylhydroquinone antioxidant, 2g of silicone compound defoamer;

[0038] The preparation method of above-mentioned nano-silver powder conductive adhesive comprises the following steps:

[0039] Step 1: Weigh 100g of epoxy resin E-51 base resin, 98g of methylhexahydrophthalic anhydride (MeHHPA) curing agent, and 0.67g of 2-ethyl-4-methylimidazole (2E4MZ) in sequence Put the curing accelerator into th...

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Abstract

The invention relates to the technical field of composite conductive adhesives, and discloses a nano-silver powder conductive adhesive with good conductivity. The nano-silver powder conductive adhesive includes the following raw materials in parts by weight: 100 parts of epoxy resin E-51 matrix resin, 98 parts of a curing agent, 0.67 part of a curing accelerator, a composite self-sintering surfactant composed of 1-3 parts of benzyltriethylammonium chloride and 1-4 parts of tetrabutylammonium hydrogen sulfate, 140-165 parts of a nano silver powder conductive filler, 1 part of a malonic acid conductive accelerator, 2 parts of a silane coupling agent, 1 part of an antioxidant and 2 parts of an antifoaming agent. The nano silver powder conductive adhesive solves the technical problem that the existing nano silver powder conductive adhesive has poor conductivity while meeting high-density connection.

Description

technical field [0001] The invention relates to the technical field of composite conductive adhesive, in particular to a nano-silver powder conductive adhesive with good conductivity. Background technique [0002] With the development of the microelectronics assembly industry towards high density and high integration and increasingly stringent environmental protection legislation, it is imperative for conductive adhesives to replace tin-lead solders in the field of microelectronics assembly. Conductive adhesives are divided into two types, one is intrinsically conductive adhesives, which refer to conjugated polymers whose molecular structure itself has conductive functions, and are mostly composed of compounds based on polyphenylene and polyacetylene, and the other is polymers Composite conductive adhesive filled with conductive particles, composite conductive adhesive is generally composed of matrix resin, curing agent, curing accelerator, diluent, conductive particles and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/06
CPCC08K2003/0806C08K2201/001C08K2201/003C08K2201/011C08K2201/014C09J9/02C09J11/06C09J163/00C08K13/02C08K5/544C08K5/13C08K5/092C08K5/19
Inventor 江仁燕
Owner 江仁燕
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