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Semiconductor wafer cleaning device and cleaning method based on heating and drying mechanism

A technology for heating, drying and cleaning devices, which is applied in the direction of using liquid cleaning methods, heating to dry solid materials, and drying solid materials, etc.

Active Publication Date: 2021-06-04
JIANGSU ASIA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The object of the present invention is to provide a semiconductor wafer cleaning device and cleaning method based on a heating and drying mechanism, so as to solve the above-mentioned problem that only a single wafer can be cleaned

Method used

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  • Semiconductor wafer cleaning device and cleaning method based on heating and drying mechanism
  • Semiconductor wafer cleaning device and cleaning method based on heating and drying mechanism
  • Semiconductor wafer cleaning device and cleaning method based on heating and drying mechanism

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Embodiment 1

[0066] see Figure 1-12 As shown, one of the purposes of this embodiment is to provide a semiconductor wafer cleaning device based on a heating and drying mechanism, including a bottom mechanism 10, a top mechanism 20 installed on the top of the bottom mechanism 10, and a drying device installed on the side of the top mechanism 20 30. The bottom mechanism 10 includes a bottom plate 110, top grooves 111 are provided on both sides of the top of the bottom plate 110, a placement piece 120 is installed on the top of the bottom plate 110, the placement piece 120 includes a placement plate 121, and several card slots 122 are arranged on the top of the placement plate 121. The bottom end of the groove 122 is provided with a bottom ring 123, and the top mechanism 20 at least includes:

[0067] The support plate 210, the bottom end of the support plate 210 is provided with several hydraulic rods 211, the top of the support plate 210 is provided with a bracket 212, the support 212 is a ...

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Abstract

The invention relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer cleaning device and cleaning method based on a heating and drying mechanism. It includes a bottom mechanism, a top mechanism installed on the top of the bottom mechanism, and a drying device installed on the side of the top mechanism. The top of the bottom mechanism is provided with a placement piece, and the top of the placement piece is provided with several card slots. The top mechanism includes a support plate, a support is provided at the top of the support plate, a chute is provided at the top of the support, a cleaning device is provided in the chute, and the cleaning device is slidably connected with the support. In the present invention, when cleaning the semiconductor wafers, multiple semiconductor wafers are placed in different slots through the brackets and placing parts provided, and the sliding cleaning device can clean the multiple semiconductor wafers, thereby improving the cleaning efficiency. efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer cleaning device and cleaning method based on a heating and drying mechanism. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, the domestic wafer production line is mainly 8 inches and 12 inches. After the semiconductor wafer is finished, it needs to be cleaned in order to remove the stains left on the surface of the wafer during the processing process. Most of the existing cleaning devices for semiconductor wafers can only clean a single wafer, resulting in too slow cleaning efficiency ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B08B3/02B08B13/00F26B3/28
CPCB08B3/02B08B13/00F26B3/28H01L21/67023H01L21/67034H01L21/67051
Inventor 钱诚李刚童建
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD
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