Contact adhesives
A composition and compound technology, applied in the direction of adhesive types, ester copolymer adhesives, non-polymer organic compound adhesives, etc., can solve problems such as inability to achieve operational strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0158] Embodiment 1 (Ex-1):
[0159] A mixture of 201 parts deionized water and 7.71 parts acrylate seeds was stirred and heated in a 2 L glass reactor equipped with a reflux condenser, mechanical stirrer, temperature probe and metering pump. When the temperature of the mixture reached 77° C., an initiator solution of 2.3 parts ammonia (25 wt. % ammonia in water) and 1.73 parts sodium persulfate in 15.53 parts deionized water was added to the reactor in one portion. After five minutes of mixing, an initiator solution containing 1.73 parts ammonium persulfate in 32.78 parts deionized water was mixed with 1028.1 parts BA, 104.7 parts MMA, 11.5 parts HEMA, 57.5 parts DAAM, 10.35 parts ammonium oleate over a period of 270 minutes. , a pre-emulsion of 0.57 parts potassium phosphate and 383.5 parts deionized water was fed into the reactor. During the first 30 minutes of the feed, the temperature was continuously increased to 80°C. 60 minutes, 180 minutes, 245 minutes and 345 minut...
PUM
| Property | Measurement | Unit |
|---|---|---|
| glass transition temperature | aaaaa | aaaaa |
| glass transition temperature | aaaaa | aaaaa |
| glass transition temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


