High-performance miniaturized directional coupler chip

Abstract

The invention relates to the field of miniaturized directional coupler chips, in particular to a high-performance miniaturized directional coupler chip, which comprises a distributed circuit and a lumped element circuit; the distributed circuit adopts a four-port microstrip directional coupler, and the four-port microstrip directional coupler comprises an input end, a straight-through end, a coupling end and an isolation end; the coupling end and the isolation end are respectively connected in series with the lumped element circuit. According to the coupler chip, the integrated circuit technology is used, the size and cost are very small, and chip formation can be achieved. Microstrip line structures are used at the output end and the straight-through end, so that low insertion loss and high-power passing capacity are achieved; the lumped element circuit is connected in series with a coupling output end of the distributed microstrip directional coupler, so that a signal output by the coupling end has very high flatness in an ultra wide band; the lumped element circuit is connected in series with an isolation output end of the distributed microstrip directional coupler, so that a signal output by the isolation end has high isolation in an ultra wide band.

Description

technical field [0001] The invention belongs to the field of miniaturized directional coupler chips, in particular to a high-performance miniaturized directional coupler chip. Background technique [0002] As a microwave low-power passive device, the directional coupler has directivity and can distribute the power of microwave signals in a certain proportion. It is a basic microwave component that is widely used in radio frequency circuits and measurement systems. With the continuous development of microwave technology, equipment has more and more stringent requirements for low cost, miniaturization, high power, ultra-wideband and high integration. The traditional directional coupler can no longer meet the requirements, and there are many problems: the orientation of the waveguide structure Couplers are bulky, costly, and difficult to integrate; directional couplers based on PCB or ceramic substrate microstrip structures have narrow bandwidth and low isolation; directional c...

AI Technical Summary

Problems solved by technology

With the continuous development of microwave technology, equipment has more and more stringent requirements for low cost, miniaturization, high power, ultra-wideband and high integration. The traditional directional coupler can no longer meet the requirements, and there are many problems: the orientation of the waveguide structure Couplers are bulky, costly, and difficult to integrate; directional couplers based on PCB or ceramic substrate microstrip structures have narrow bandwidth and low isolation; directional couplers using lumped element structures have large losses, low power resistance, and low isolation

[0003] All the above-mentioned circuit solutions cannot meet the current demand for high-performance directional couplers, especially the miniaturization and chip-based technical solutions.

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