Wafer wet processing workstation

Abstract

The utility model provides a wafer wet processing work station. The wafer wet processing work station comprises a soaking tank, a mechanical arm and single wafer processing equipment, and the wafer is immersed in the immersion tank filled with the process liquid in advance in a manner that the plate surface of the wafer is vertical to the horizontal plane. The mechanical arm comprises a holding part and an overturning part. The wafer is held on the holding part. The overturning part controls the holding part to turn over relative to the horizontal plane. The holding part is overturned by 90 degrees through the overturning part, so that the wafer is conveyed in a manner that the plate surface of the wafer is parallel to the horizontal plane. A single wafer processing apparatus applies a cleaning liquid to the plate surface of the wafer soaked in the process liquid. The wafer wet processing work station can perform a series of cleaning processes such as soaking and spray washing on the wafer so as to realize cleaning of the wafer with chip miniaturization and high-density wire layout.

Description

technical field [0001] The present disclosure relates to a workstation, in particular to a wafer wet processing workstation. Background technique [0002] Along with the miniaturization of semiconductor components and the increase of chip interconnection pattern density, the wires are gradually developing towards a smaller line width and line spacing (fine line width and space), which makes the semiconductor cleaning and etching process face a challenge. more serious challenges. At present, wafers or substrates usually require multiple cleaning and etching processes to ensure that the final cleaning and etching effects can meet the process specifications of the components, especially in photoresist stripping, metal lift-off, and in After wafer debonding (post wafer de-bonding), the cleaning and removal process of residues of the adhesive layer and release layer on the wafer surface cannot be completed by relying on a single process. A combination of wafer soak and single w...

AI Technical Summary

Problems solved by technology

However, in the wafer immersion equipment, if the wafers are placed horizontally, when the cassette is completely immersed in the soaking tank, the holding mechanism cannot take out the wafers individually and individually, and must wait until the cassette is lifted and left After soaking the tank, the holding mechanism can enter the cassette to take out the wafer

However, in the same cassette, the wafers taken out earlier tend to be under-soaked, while the wafers taken out later are prone to over-soaking and damage to the wafers

That is to say, the use of horizontal wafer immersion equipment cannot accurately control the immersion time of each wafer in the chemical immersion tank, which will easily affect the yield of the wafer immersion process

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