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LED wafer, LED wafer detection device, and LED wafer detection method

A technology of light-emitting diodes and detection devices, which is used in diode testing, measuring devices, measuring electricity and other directions

Pending Publication Date: 2021-05-14
ASTI GLOBAL INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is still room for improvement in the detection of LED chips in the prior art

Method used

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  • LED wafer, LED wafer detection device, and LED wafer detection method
  • LED wafer, LED wafer detection device, and LED wafer detection method
  • LED wafer, LED wafer detection device, and LED wafer detection method

Examples

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no. 1 example

[0026] refer to Figure 1 to Figure 4 As shown, the first embodiment of the present invention provides an LED wafer inspection device Z, which includes: an LED wafer 1 and a photodetection module 2 .

[0027] First, cooperate Figure 1 to Figure 3 As shown, the LED wafer 1 includes a wafer substrate 10, a plurality of LED chips 11, a plurality of positive circuit layers 12P for testing, a plurality of negative circuit layers 12N for testing, a plurality of positive contacts 13P for testing and a plurality of The negative electrode contact 13N is used for testing, and the photodetection module 2 is disposed above the LED wafer 1 . For example, a plurality of light-emitting diode chips 11, a plurality of positive circuit layers 12P for testing, a plurality of negative circuit layers 12N for testing, a plurality of positive contacts 13P for testing, and a plurality of negative contacts 13N for testing are all made of semiconductors. The process is provided on the wafer substrat...

no. 2 example

[0033] refer to Figure 5 and Figure 6 As shown, the second embodiment of the present invention provides a light-emitting diode wafer detection device, which includes: a light-emitting diode wafer 1 and a light detection module (not shown in the figure). Depend on Figure 5 and figure 1 comparison of and Figure 6 and figure 2 It can be seen from the comparison that the biggest difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, a plurality of test positive contacts 13P are connected to each other to form a single positive test area, and multiple test The negative contacts 13N are connected to each other to form a single negative test area. That is to say, in addition to using a single positive test contact (a single test positive contact 13P) and a single negative test contact (a single test negative contact 13N) in the present invention, a single LED wafer 1 can be tested. detection (as with fi...

no. 3 example

[0035] refer to Figure 7 and Figure 8 As shown, the third embodiment of the present invention provides an LED wafer inspection device, which includes: an LED wafer 1 and a photodetection module (not shown in the figure). Depend on Figure 7 and Figure 5 , figure 1 comparison of and Figure 8 and Figure 6 , figure 2 It can be seen from the comparison that the biggest difference between the third embodiment of the present invention and the first and second embodiments is that in the third embodiment, some of the plurality of test positive contacts 13P will be separated from each other to form a plurality of adjacently arranged A single positive test contact, and a part of the plurality of negative test contacts 13N for testing are separated from each other to form a plurality of single negative test contacts arranged adjacent to each other. In addition, the rest of the positive test contacts 13P are connected to each other to form a single positive test area, and the...

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Abstract

An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts, each LED chip is excited to generate a light source.

Description

technical field [0001] The invention relates to a wafer and a wafer detection device and method, in particular to a light emitting diode wafer and a light emitting diode wafer detection device and method. Background technique [0002] Currently, light-emitting diodes (Light-Emitting Diodes, LEDs) are widely used due to their good light quality and high luminous efficiency. Generally speaking, in order to enable display devices using light-emitting diodes as light-emitting components to have better color performance capabilities, the prior art uses red, green, and blue light-emitting diode chips to match each other to form a full-color light emitting display. Diode display equipment, this full-color light-emitting diode display equipment can use red, green, and blue three-color light-emitting diode chips to emit red, green, and blue color lights, and then form a full-color light after mixing light. , to display related information. However, there is still room for improveme...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R31/26
CPCG01R31/2831G01R31/2601G01R31/2635H01L22/32H01L33/0095H01L33/62H01L22/34
Inventor 廖建硕张德富卢俊安
Owner ASTI GLOBAL INC
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