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Manufacturing method of multi-channel integrated component

A technology of integrated components and manufacturing methods, applied in optical components, light guides, optics, etc., can solve the problems of unstable work performance, portability, troublesome installation, and difficult management of integrated components, and achieve easy installation, high work efficiency, and guaranteed The effect of performance stability

Pending Publication Date: 2021-05-14
重庆霓扬科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult for a single adjustment component to meet the requirements of the transmission scale, and the use of multiple adjustment components is difficult to manage because they are separated from each other, and there are also problems of carrying and installation troubles
[0004] On the other hand, if multiple substrates are directly integrated together, although the integration level is improved and more usage requirements can be met, the substrates will generate signal interference during operation, which will affect the work of each other, resulting in poor performance of the integrated components. Stablize

Method used

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  • Manufacturing method of multi-channel integrated component
  • Manufacturing method of multi-channel integrated component
  • Manufacturing method of multi-channel integrated component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 1 , figure 2 As shown, the multi-channel integrated component manufacturing method includes:

[0040] The manufacturing step of the installation box is to manufacture the installation part 1, the upper cover plate 2 and the lower cover plate 3 of the installation box; the upper cover plate 2 and the lower cover plate 3 are flat plates; the installation part 1 is made of cutting material.

[0041] The bottom surface and the top surface of the installation part 1 are both flat, and there are multiple independent installation cavities on the installation part 1. The installation cavities are grooves running through the top surface of the installation part 1. An output port is opened on the wall, and an input port is opened on the rear side wall; a power board access slot is opened at the bottom of the installation part 1; wherein, the number of installation cavities is more than three, and the size and shape of each installation cavity are consistent. In ...

Embodiment 2

[0053] The difference from Embodiment 1 is that in this embodiment, in the manufacturing step of the installation box, an inner cover 5 is also made, and the inner cover 5 fits with the upper opening of the installation cavity; in the packaging step, the inner cover 5 is firstly closed On the installation cavity, the upper cover plate 2 is fixed on the top of the installation part 1 . Such a manufacturing method can further ensure the independence between the installation cavities, thereby ensuring the stability of the working performance of the integrated component.

Embodiment 3

[0055] Such as image 3 , Figure 4As shown, the difference from Embodiment 1 is that in this embodiment, there are cooling ports on the side wall where the output port and the input port are located on the mounting part 1; a cooling motor 11 and a cooling blade 12 are arranged in the cooling port, and the cooling blade 12 fixed on the rotating shaft of the fan heating motor; the fan heating motor is electrically connected to the microcontroller; a temperature sensor is fixed on the inner wall of the installation cavity, and the temperature sensor is electrically connected to the microcontroller;

[0056] The horizontal direction of the installation cavity inner wall is fixed with an electric telescopic rod 14, and the electric telescopic rod 14 is electrically connected with the microcontroller; The other end is fixed with a baffle 13, and the baffle 13 is in contact with the inner wall; in the initial state, the baffle 13 completely blocks the cooling opening;

[0057] It ...

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Abstract

The invention belongs to the technical field of semiconductors, and particularly relates to a multi-channel integrated component manufacturing method which comprises the following steps: a mounting box manufacturing step: manufacturing a mounting part, an upper cover plate and a lower cover plate of a mounting box; setting a plurality of independent mounting cavities in the mounting part, forming power supply connecting holes in the bottoms of the mounting cavities, forming output ports in the front side walls of the mounting cavities, and forming input ports in the rear side walls of the mounting cavities; and forming a power panel access groove in the bottom of the mounting part; a power supply installation step: installing the power supply board in the power supply board access groove; a substrate mounting step: mounting hybrid integrated substrates in the mounting cavities; an input and output access step: enabling optical fibers to pass through the input ports to be coupled with a high-speed photoelectric conversion chip, and enabling a radio frequency connector to pass through an output port to be electrically connected with an amplifier; and a packaging step: fixing the lower cover plate at the bottom of the mounting part, and fixing the upper cover plate at the top of the mounting part. According to the integrated component manufactured through the method, the integration degree is improved, and meanwhile the stability of the working performance can be guaranteed.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a method for manufacturing a multi-channel integrated component. Background technique [0002] In the modern optical fiber communication system, it is necessary to use a photoelectric converter to convert the optical signal transmitted through the optical fiber into an electrical signal, so as to realize the monitoring, maintenance and signal processing of the optical fiber network. [0003] With the development of microwave photon transmission technology, the scale of the transmission system is getting larger and larger, and a single light adjustment component is no longer enough to meet most usage scenarios, and multiple adjustment components are required to be used together in many cases. But the existing regulating components are all separated, that is, each regulating component is separated. It is difficult for a single adjustment component to meet the requirements o...

Claims

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Application Information

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IPC IPC(8): G02B6/42
CPCG02B6/4255G02B6/426
Inventor 肖楠刘均刘浪
Owner 重庆霓扬科技有限责任公司