A kind of multi-chip semiconductor package and its forming method
A semiconductor and multi-chip technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as the stability of multi-chip packaging structures
Active Publication Date: 2022-05-06
湖南中科存储科技有限公司
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Problems solved by technology
[0003] In order to solve the technical problem that the multi-chip packaging structure in the prior art causes the generation of silicon dangling bonds during the curing process of the plastic sealing layer, thereby causing the stability of the multi-chip packaging structure to decrease, the invention proposes a multi-chip semiconductor package and its formation method
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[0033]It is to be appreciated that the following disclosure provides many different embodiments, or examples, for implementing different components of the presented subject matter. Specific examples of each component and its arrangement are described below in order to simplify the description of the disclosure. Of course, these are examples only and are not intended to limit the present disclosure. For example, the following disclosure describes that a first component is formed on or over a second component, which means that it includes the embodiment in which the first component is formed in direct contact with the second component, and also includes In addition, an additional component may be formed between the first component and the second component, so that the first component may not be in direct contact with the second component. In addition, different examples in the disclosure may use repeated reference signs and / or words. These repetitions or words are used for sim...
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Abstract
The invention relates to a multi-chip semiconductor package and a forming method thereof. During the curing process of the plastic sealing resin layer, the segmented curing process can effectively suppress the formation of silicon dangling bonds in the silicon-based transistor during the curing process. In the oxygen atmosphere, silicon-based transistors can fully produce silicon dangling bonds, and then through the heat treatment process in nitrogen atmosphere to completely discharge oxygen, and then in the subsequent curing process, sufficient heat treatment is carried out through different hydrogen atmospheres, so that silicon-based transistors The silicon dangling bonds on the surface are fully converted into silicon-hydrogen bonds, thereby effectively improving the stability of silicon-based transistors.
Description
technical field [0001] The invention relates to the field of chip packaging, in particular to a multi-chip semiconductor package and a forming method thereof. Background technique [0002] Semiconductor packaging technology came into being with the invention of integrated circuits, and its main functions are to complete power distribution, signal distribution, rapid heat dissipation and chip protection. Along with the diversified development of semiconductor chip technology, the corresponding semiconductor packaging technology is also continuously innovated accordingly. The packaging interconnection density continues to increase, the packaging thickness continues to decrease, and the three-dimensional packaging and system packaging methods continue to evolve. With the diversification of integrated circuit applications, the rapid development of emerging fields such as smart portable devices, Internet of Things, automotive electronics, cloud computing, 5G technology, and arti...
Claims
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IPC IPC(8): H01L21/50H01L21/56H01L21/60H01L21/683H01L23/31H01L25/18
CPCH01L21/50H01L21/568H01L24/03H01L21/6835H01L23/3107H01L25/18H01L2221/68386H01L2221/68372
Inventor 孙德瑞
Owner 湖南中科存储科技有限公司