Gold plating process for solving diffusion of selective gold plating area and improving gold plating function

A gold-plated area and selective technology, which is applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of affecting the wear resistance of products, the lack of wear resistance of the gold plating process, and the influence of the surface area division of gold-plated products.

Pending Publication Date: 2021-05-18
SUZHOU PLATER ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is: in order to solve the lack of inhibitors in the gold-plating potion, after the surface treatment potion is partially gold-plated in the gold-plated area, due to the fluidity and ductility of the potion itself, the gold-plating is easy to produce an overflow area on the surface of the product, affecting The surface area of ​​the gold-

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The present invention provides a technical solution: a gold plating process that solves the problem of selective gold plating area diffusion and improves the gold plating function, specifically comprising the following steps: S1, preparing a gold plating solution, putting the raw material of the gold plating solution into a mixing tank to heat up and fully stir to defoam, After fully mixing, fully filter through continuous filter equipment, and leave the filtered solution for later use;

[0036] S2, auxiliary solution preparation, at first to gold-plating inhibitor preparation, the gold-plating inhibitor raw material is placed in the stirring tank and fully stirred, and after stirring is completed, the gold-plating solution after standing is put into the stirring tank to mix the gold-plating inhibitor and The gold-plating solution is fully mixed, and the mixed solution is detected by a pH meter;

[0037] S3. Preparation of gold-plated products. Finely grind the gold-pla...

Embodiment 2

[0044]When different from Embodiment 1, this embodiment also provides a gold plating process that solves the problem of selective gold plating area diffusion and improves the gold plating function, which specifically includes the following steps: S1. Prepare a gold plating solution, and put the gold plating solution raw materials into a mixing tank for Raise the temperature and fully stir to defoam. After fully mixing, fully filter through continuous filter equipment, and leave the filtered solution to stand for later use;

[0045] S2, auxiliary solution preparation, at first to gold-plating inhibitor preparation, the gold-plating inhibitor raw material is placed in the stirring tank and fully stirred, and after stirring is completed, the gold-plating solution after standing is put into the stirring tank to mix the gold-plating inhibitor and The gold-plating solution is fully mixed, and the mixed solution is detected by a pH meter;

[0046] S3. Preparation of gold-plated produ...

Embodiment 3

[0053] When different from Embodiment 1, this embodiment also provides a gold plating process that solves the problem of selective gold plating area diffusion and improves the gold plating function, which specifically includes the following steps: S1. Prepare a gold plating solution, and put the gold plating solution raw materials into a mixing tank for Raise the temperature and fully stir to defoam. After fully mixing, fully filter through continuous filter equipment, and leave the filtered solution to stand for later use;

[0054] S2, auxiliary solution preparation, at first to gold-plating inhibitor preparation, the gold-plating inhibitor raw material is placed in the stirring tank and fully stirred, and after stirring is completed, the gold-plating solution after standing is put into the stirring tank to mix the gold-plating inhibitor and The gold-plating solution is fully mixed, and the mixed solution is detected by a pH meter;

[0055] S3. Preparation of gold-plated prod...

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PUM

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Abstract

The invention discloses a gold plating process for solving diffusion of a selective gold plating area and improving a gold plating function, and belongs to the technical field of surface treatment solutions. The gold plating process comprises the steps that S1, preparing a gold plating solution, S2, preparing an auxiliary solution; S3, preparing a gold-plated product; S4, plating nickel; S5, coating the gold plating solution; and S6, performing a salt spray functional test. According to the gold plating process for solving the diffusion of the selective gold plating area and improving the gold plating function, the boundary line of a gold plating area region is clear, external invalid region diffusion is avoided, the functional test of a gold plating layer is improved, and the gold plating use amount cost is reduced; a developed special inhibitor additive is added into gold plating liquid medicine, so that the effective region after gold plating is regular and the boundary line is clear; through the salt spray functional test, the corrosion of a primary battery generated in the salt spray test is reduced due to the diffusion of the gold layer region, the salt spray test capability is improved, the product quality is improved, the diffusion of the gold layer in the ineffective area is solved due to the inhibitor additive, the usage amount of a noble metal gol is greatly reduced d, and the cost is greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of surface treatment solutions, and in particular relates to a gold plating process which solves the problem of diffusion in selective gold plating areas and improves the gold plating function. Background technique [0002] In order to protect and decorate the surface of metal products, the surface of metal products is generally gold-plated with surface treatment potions. In the gold-plating process, the most important thing is the ratio of gold-plated potions. The process of plating a thin layer of other metals or alloys on the surface is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. [0003] In the prior art, due to the lack of inhibitors in the gold-plating potion, after the surface treatment potion is partially gold-plated on the gold-plated area, due to the fluidity and ductility of the potion itself, the gold-...

Claims

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Application Information

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IPC IPC(8): C25D5/12C25D21/10C25D21/06C25D3/12C25D3/62C25D5/02
CPCC25D5/12C25D21/10C25D21/06C25D3/12C25D3/62C25D5/02
Inventor 邓金虎
Owner SUZHOU PLATER ELECTRONICS CO LTD
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