Airborne multi-nozzle spray cooling system and method applying multi-cold-source composite phase change material heat exchanger and ejector

Abstract

The invention discloses an airborne multi-nozzle spray cooling system and method applying a multi-cold-source composite phase change material heat exchanger and an ejector, and belongs to the field of airborne high-heat-flux equipment cooling. The invention mainly solves the problem of continuous heat dissipation of high-heat-flux surfaces such as radar chips and laser weapons when an airborne cold source cannot be directly used. A high-heat-density surface is cooled in a spray cooling mode, ram air is used as a main cold source, a vortex refrigeration box is used as an auxiliary cold source, airborne fuel oil is used as an emergency cold source, and when the to-be-cooled surface needs to be cooled, the combination mode of the two sets of cold sources is determined according to the temperature change of the to-be-cooled surface. Three groups of phase change materials are used as intermediate energy storage media corresponding to three cold sources. Engine tail gas and hot air are used as injection air sources, a low-pressure environment is created in the spraying chamber, cooling water is subjected to boiling heat exchange, and heat exchange in the spraying chamber is enhanced. The system is safe and stable in operation and high in redundancy, and the cooling requirement under the airborne complex environment is met.

Description

technical field [0001] The invention relates to an airborne multi-nozzle spray cooling system and method using a multi-cooling source composite phase change material heat exchanger and an ejector, and belongs to the field of airborne high heat flux density electronic equipment cooling. Background technique [0002] With the rapid development of airborne radar technology, power amplifier chips have developed from silicon chips and GaAs chips to third-generation semiconductor GaN chips. Several projects from the US Navy and Air Force show that the heat flux density of GaN chips under development has reached 500W / cm 2 , the heat flux density of future chips will exceed 1000W / cm 2 . At the same time, with the continuous improvement of the requirements for military aircraft maneuverability, stealth performance, and defense performance, technologies such as high-power laser technology, high integration and miniaturization of electronic components have developed rapidly. Laser w...

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Problems solved by technology

[0003] Some patents have proposed the application method of spray cooling in the airborne field. Patent ZL201721063995.1 proposes an airborne turbine intermittent cold storage spray cooling system for laser weapons. The main feature is that the turbine is used as a cooling device and a power source. The intercooler is completely provided by the turbine, which increases the load on the original turbine refrigeration system of the aircraft, which is not conducive to the long-term stable operation of the aircraft

Patent ZL201821217918.1 proposes an airborne spray cooling system using ram air and evaporative refrigeration cycle to cool circulating water. The main feature is that ram air is used as the main cooling source and evaporative refrigeration cycle as the auxiliary cooling source. The characteristic is that the evaporative refrigeration cycle is used to provide cooling capacity for the spray medium. However, the airborne space is limited, and the cooling capacity of the evaporative refrigeration cycle is limited. At the same time, the ram air is used as the main cooling source. When the ram air cannot be used, there is no emergency cooling source.

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