Wafer-level lens module array assembly structure, lens module and production method thereof

Abstract

The invention discloses a wafer-level lens module array assembly structure, a lens module and a production method thereof. The assembly structure comprises multiple layers of wafer-level lens arrays stacked together, and each wafer-level lens array comprises a wafer substrate and lens units arranged on the wafer substrate in an array mode. Every two adjacent layers of wafer-level lens arrays are bonded and fixed through glue or are respectively bonded and fixed to the two sides of the same wafer spacing piece through glue, a plurality of dispensing grooves are formed around the lens units in a surrounding mode, every two adjacent dispensing grooves are communicated through a glue containing flow guide groove, and the dispensing grooves and the glue containing flow guide grooves form a closed glue containing space surrounding the lens units. Glue is filled into the closed glue containing space to bond the two layers of wafer-level lens arrays or respectively bond the two layers of wafer-level lens arrays on the two sides of the wafer spacing piece. By adopting the assembly structure, bubble cavities can be prevented from appearing on the gluing surfaces when the wafer-level lens arrays are fixed by gluing, and the production yield of the lens assembly is improved.

Description

technical field [0001] The present invention relates to WLO (Wafer Level Optics: Wafer Level Optical Element) manufacturing technology, in particular to a wafer level lens module array assembly structure and a wafer level lens module production method, which are used for realizing multiple wafer level lens modules Adhesive bonding between arrays and wafer-level lens module production. Background technique [0002] WLO refers to a micro-nano-structured optical element made by using a semiconductor process to generate a micro-nano structure on a substrate wafer. Different from the processing technology of traditional optical components, the WLO process uses semiconductor technology to batch copy and process lens arrays on the entire wafer substrate to form a wafer-level lens module array, and then press multiple wafer-level lens module arrays. Put together, and then cut into a single lens, which has the characteristics of small size, low height, and good consistency. The pos...

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Problems solved by technology

[0003] When assembling the wafer-level lens module array, it can be fixed by glue bonding. During the glue bonding, due to the lack of space for the glue on the wafer substrate, it is difficult to control the state of the glue after coating, and bubbles and cavities are prone to appear after the glue is cured. , affecting the production yield of lens components

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