Variable capacitor and semiconductor process equipment

Abstract

One or more embodiments of the invention disclose a variable capacitor and semiconductor process equipment, which are used for solving problems that the capacitance value of the existing variable capacitor is difficult to quickly and continuously adjust and an impedance matching effect in the semiconductor process equipment is poor. A capacitor body and a capacitor control module which are connected are included. The capacitor body comprises bias electrode plates which are oppositely arranged, radio frequency electrode plates which are oppositely arranged and insulating connecting plates which are oppositely arranged, and the bias electrode plates, the radio frequency electrode plates and the insulating connecting plates are connected with one another to define a closed space; the closed space is filled with a specified medium; the dielectric constant of the specified medium changes along with the change of the voltage applied to the bias electrode plates; and the capacitance control module is used for receiving a target capacitance value and applying the voltage corresponding to the target capacitance value to the bias electrode plates. According to the variable capacitor, the effect of rapidly and continuously adjusting the capacitance value can be achieved, and the impedance matching effect of the semiconductor process equipment adopting the variable capacitor can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a variable capacitor and semiconductor process equipment. Background technique [0002] In the semiconductor industry, it is often necessary to use plasma for deposition or etching. However, the impedance of the plasma changes with the change of factors such as pressure, power, and gas type, and the impedance of the plasma is very different from the output impedance of the RF power supply. , if the RF power is directly connected to the plasma chamber, a large amount of reflected power will inevitably be generated. In order to enable the output energy of the RF power supply to be transferred to the plasma chamber as much as possible, it is usually necessary to arrange an impedance matcher between the RF power supply and the plasma chamber, so that the output impedance of the RF power supply and the load impedance (the impedance of the impedance matcher and the ...

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Problems solved by technology

[0005] The purpose of one or more embodiments of the present invention is to provide a variable capacitor and semiconductor process equipment to solve the problems that the existing variable capacitors are difficult to quickly and continuously adjust the capacitance value and the impedance matching effect in the semiconductor process equipment is poor. question

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