Memory based on spin texture, and preparation method thereof
A memory and texture technology, applied in the storage field, can solve the problems of inability to further reduce the size, fail to meet high-density integration, and limited information writing speed, and achieve fast information reading speed, low power consumption, and small size Effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2021-06-08
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention belongs to the field of memory technology, and in particular relates to a memory based on spin texture and a preparation method thereof. Background technique
[0002] More than half a century has passed since the invention of memory. With the rise and rapid development of new information technologies such as artificial intelligence, the Internet of Things, and big data, the amount of data is growing explosively, and the demand for data storage and processing speed is also increasing. getting stronger. Therefore, the bottleneck problem of storage is becoming more and more prominent in the development of modern information society. In order to solve this problem, the current main technical solutions include magnetic field writing MRAM based on spintronics and SOT- and STT-MRAM based on spin interaction. FRAM based on electrical materials, PRAM based on material phase change and RRAM based on resistive switching effect.
[0003] MRAM: Its ...
Examples
Embodiment Construction
[0032] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.
[0033] like figure 1 As shown, a spin texture-based memory provided by an embodiment of the present invention includes a substrate 1, a ferroelectric layer 2 and a ferromagnetic layer 3;
[0034] The ferroelectric layer 2 is located on the substrate 1;
[0035] The ferromagnetic layer 3 is located on the ferroelectric layer 2;
[0036] The material of the substrate 1 is a conductive material, and the material of the ferroelectric layer 2 is GeTe, SnTe or HfO 2 , the material of the ferromagnetic layer 3 is a material that conducts electrons with spin polarization.
[0037] In the above embodiment, the substrate 1 and the ferromagnetic layer 3 can be used as electrodes to apply an electric field to the ferroelectr...