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MEMS chip and manufacturing method thereof, MEMS microphone module and electronic equipment

A manufacturing method and microphone technology, applied in the field of microphones, can solve problems such as affecting the yield and reliability of MEMS chips, and easily damaging the diaphragm.

Active Publication Date: 2021-06-18
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the diaphragm of this MEMS chip is subjected to instantaneous high pressure from air blowing or jetting, it is difficult to quickly release the pressure to maintain air pressure balance, resulting in easy damage to the diaphragm, which in turn affects the yield and reliability of the MEMS chip.

Method used

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  • MEMS chip and manufacturing method thereof, MEMS microphone module and electronic equipment
  • MEMS chip and manufacturing method thereof, MEMS microphone module and electronic equipment
  • MEMS chip and manufacturing method thereof, MEMS microphone module and electronic equipment

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Embodiment Construction

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0049] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0050] In the present in...

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Abstract

The invention discloses an MEMS chip, a manufacturing method of the MEMS chip, an MEMS microphone module and electronic equipment. The MEMS chip comprises a substrate, a vibrating diaphragm and a back polar plate, the vibrating diaphragm is arranged on the surface of the substrate, the vibrating diaphragm is convexly provided with a first bulge, and the first bulge is provided with an air leakage hole penetrating through the vibrating diaphragm; the back polar plate is electrically connected to one side, back to the substrate, of the vibrating diaphragm, a vibrating gap is formed between the back polar plate and the vibrating diaphragm, the first bulge is located in the vibrating gap, the air leakage hole is communicated with the vibrating gap, and the back polar plate is provided with an open hole communicated with the vibrating gap. According to the technical scheme, the MEMS chip can maintain air pressure balance, and the yield and reliability are guaranteed.

Description

technical field [0001] The invention relates to the technical field of microphones, in particular to a MEMS chip and a manufacturing method thereof, a MEMS microphone module and electronic equipment. Background technique [0002] In the MEMS (micro electromechanical system) microphone chip in the related art, in order to prevent the diaphragm from sticking to the back plate when it vibrates, a raised structure is usually provided in the vibration gap between the diaphragm and the back plate for anti-sticking . However, when the diaphragm of this MEMS chip is subjected to instantaneous high pressure from blowing or spraying air, it is difficult to quickly release the pressure to maintain the air pressure balance, resulting in easy damage to the diaphragm, which in turn affects the yield and reliability of the MEMS chip. Contents of the invention [0003] The main purpose of the present invention is to provide a MEMS chip, aiming at maintaining air pressure balance and ensu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R7/06H04R31/00
CPCH04R19/04H04R7/06H04R31/00H04R2201/003
Inventor 周宗燐邱冠勋
Owner GOERTEK MICROELECTRONICS CO LTD