Sectional type rotary scanning micropore array processing device and processing method thereof

Abstract

The invention provides a sectional type rotary scanning micropore array processing device and a processing method thereof. The device comprises a high repetition frequency ultrafast laser, reflectors, a diaphragm, an objective lens, a laser galvanometer, a composite motion platform and a rotary table. According to the method, the high repetition frequency ultrafast laser is used for generating femtosecond magnitude ultrafast pulses, the femtosecond magnitude ultrafast pulses penetrate through the microscope objective lens to reach a workpiece through a set laser path, meanwhile, the workpiece is fixed on a high-precision electric control rotary table through a clamp, and through the cooperation of radial horizontal movement and circumferential rotation of the rotary table driven by the composite motion platform, finally, micropore arrays are stably, uniformly and efficiently processed in a large area by combining a sectional type processing algorithm. According to the method, the sectional algorithm is innovatively put forward, and processing of a large-area part can be efficiently completed while the stability of each section during rotary processing and the uniformity of the micropore arrays are guaranteed; the processing laser power is constant, processing can be completed at a time only by simply controlling the platform to move through computer programs, and operation is easy.

Description

technical field [0001] The invention relates to the technical field of micro-nano processing, in particular to a segmented rotary scanning microhole array processing device and a processing method thereof. Background technique [0002] Laser micro-hole processing technology is to use the characteristics of the interaction between laser pulses and substances to scan and process micro-holes in materials (including metals and non-metals), involving multi-disciplinary comprehensive technologies such as optics, mechanics, electricity, computer control, material properties and detection. . Laser microhole processing is widely used in high-tech industries such as automobiles, microelectronics, optical communications, aerospace, biomedicine, solar energy and fuel cell new energy, improving and replacing some traditional processing methods. The use of ultrafast laser direct writing to process the microhole array structure has very good advantages: the ultrashort pulse has extremely ...

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Problems solved by technology

However, this method cannot be well applied to microhole array processing. Microhole array processing needs to always ensure constant power to make the quality of processed microholes uniform, and ensure constant scanning speed to make the spacing between microholes uniform.

First of all, the constant linear velocity rotary machining proposed by them theoretically requires continuous change of angular velocity, but it is difficult to achieve continuous change of angular velocity while requiring high rotational accuracy. Secondly, the constant angular velocity variable power machining they proposed cannot guarantee micro The hole processing quality is consistent, and the continuity of the micro-hole array processing is very important, and the same place cannot have repetitive pulses

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