A Segmented Rotary Scanning Microhole Array Machining Method

Abstract

The invention provides a segmented rotary scanning micro-hole array processing device and a processing method thereof. The device comprises a high repetition frequency ultrafast laser, a reflection mirror, a diaphragm, an objective lens, a laser galvanometer, a compound motion platform and a rotary table. The method of the present invention uses a high repetition frequency ultrafast laser to generate femtosecond ultrafast pulses, passes through the microscope objective lens through a set laser path to reach the workpiece, and at the same time the workpiece is fixed on a high-precision electronically controlled rotary table by a fixture, The composite motion platform drives the radial translation of the rotary table and the coordination of the circumferential rotation, combined with the segmented processing algorithm, the micro-hole array is finally processed stably, uniformly, efficiently and in a large area. The invention innovatively proposes a segmented algorithm, which can efficiently complete the processing of large-area parts while ensuring the stability and uniformity of the micro-hole array during each stage of rotary processing; the processing laser power is constant, and only a computer program is needed. The processing can be completed at one time by simply controlling the movement of the platform, and the operation is simple.

Description

technical field [0001] The invention relates to the technical field of micro-nano processing, in particular to a segmented rotary scanning micro-hole array processing method. Background technique [0002] Laser micro-hole processing technology is to use the characteristics of the interaction between laser pulses and substances to scan and process micro-holes in materials (including metals and non-metals), involving multi-disciplinary comprehensive technologies such as optics, mechanics, electricity, computer control, material properties and detection. . Laser microhole processing is widely used in high-tech industries such as automobiles, microelectronics, optical communications, aerospace, biomedicine, solar energy and fuel cell new energy, improving and replacing some traditional processing methods. The use of ultrafast laser direct writing to process the microhole array structure has very good advantages: the ultrashort pulse has extremely low "thermal effect", and at th...

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Problems solved by technology

However, this method cannot be well applied to microhole array processing. Microhole array processing needs to always ensure constant power to make the quality of processed microholes uniform, and ensure constant scanning speed to make the spacing between microholes uniform.

First of all, the constant linear velocity rotary machining proposed by them theoretically requires continuous change of angular velocity, but it is difficult to achieve continuous change of angular velocity while requiring high rotational accuracy. Secondly, the constant angular velocity variable power machining they proposed cannot guarantee micro The hole processing quality is consistent, and the continuity of the micro-hole array processing is very important, and the same place cannot have repetitive pulses

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