Electronic industry-oriented circuit board identification and bonding pad/chip rapid positioning method
A technology in the electronics industry and a positioning method, which is applied in image data processing, instruments, calculations, etc., can solve problems such as being susceptible to external environmental interference, low positioning efficiency, and dense target points, so as to achieve low external environmental interference, excellent recognition rate, Create simple effects
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[0045] The specific functional objectives of the present invention can be divided into two parts: one is to realize the rapid identification and classification of various printed circuit boards, and establish a standard identification library, so that the identification success rate is higher than 99%; The position information of the pads of the circuit board or the chipset, so as to realize the fast and precise positioning of the measured target, and ensure that the algorithm efficiency is better than 200ms.
[0046] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0047] The technical solution of the present invention is divided into two parts: one is the rapid identification and classification technology of multi-type printed circuit boards under the free posture;
[0048] 1. Rapid identification and classification technology of multi-type printed circuit boards in free posture
[0049] The cor...
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