Electronic industry-oriented circuit board identification and bonding pad/chip rapid positioning method

Abstract

The invention belongs to the field of the electronic industry, and particularly relates to a circuit board identification and bonding pad/chip precise and rapid positioning method. The method comprises the following steps: carrying out noise filtering and threshold segmentation on a to-be-recognized original image to obtain an ROI (Region of Interest); performing affine transformation on the ROI to obtain an image of a horizontal attitude; carrying out adaptive threshold processing on the image of the horizontal attitude to obtain a recognition target; and carrying out deformable component image matching (DPM) based on contour curvature angular point features and pyramid model search on the identified target and the model database, and completing matching, namely completing rapid positioning of the chip. According to the invention, rapid identification and classification of various printed circuit boards can be realized. According to the method, the area position of the bonding pad group point can be accurately positioned, the robustness is high, the adverse influence of the bonding pad or the chip group area due to image deformation can be overcome, and the algorithm execution efficiency is high. The method can meet the special requirements of intelligent mistake and omission prevention, mixed line production of circuit boards and the like in the electronic industry.

Description

technical field [0001] The invention is oriented to the field of electronics industry, and specifically relates to a circuit board identification and pad / chip precise and fast positioning method. Background technique [0002] At present, there are four common problems in the demand side of the electronic manufacturing industry in the parts manufacturing and assembly process: labor-intensive automation, high labor costs, difficulty in recruiting people, complex processes and fast replacement, low labor efficiency and yield, and short delivery times. Machine vision is an important part of the research in the field of collaborative small assembly robots, especially the technology of circuit board recognition and pad / chip rapid positioning, which is the key to realizing small batch customization, personalized manufacturing and flexible manufacturing in the electronics manufacturing industry. In the field of machine vision research, object recognition by analyzing images is an im...

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Problems solved by technology

[0003] The invention is closely related to the actual needs, and aims at the problems of robot visual guidance and fast and precise positioning, adopts the modeling and matching algorithm based on the multi-layer contour feature model, realizes the rapid identification and classification of various printed circuit boards, and aims at the existing methods Due to the problems of low positioning efficiency, dense target points and susceptibility to external environment interference, a modeling and matching algorithm based on the multi-layer deformable component model is proposed, which realizes the rapid and precise positioning of the target solder joint group of the printed circuit board, and the fitting Multi-target center coordinates, the position information of the pad and chipset is transmitted to the robot control and motion execution system, so as to realize the attachment, assembly, sorting, grinding, dispensing, testing, Welding and other processes provide the necessary key technologies

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