A kind of conductive material forming process

Abstract

This application relates to the technical field of conductive tape processing, in particular to a conductive material molding process, which includes the following steps, step 1, bonding the conductive adhesive tape to the base film; The pasting area is located in the middle of the conductive adhesive tape, and the isolation area is located on both sides of the pasting area. Two diaphragms with a size equal to the size of the isolation area are stacked on the isolation area and pressed together; step 3, stack the conductive sponge tape, take a size larger than The conductive sponge tape in the pasting area is superimposed on the pasting area, and the part of the conductive sponge tape that exceeds the pasting area is superimposed on the diaphragm; step 4, die-cut the part of the conductive sponge tape that exceeds the pasting area and exclude it; step 5, attach the conductive sponge tape and Conductive adhesive tape, paste the conductive sponge adhesive tape superimposed on the pasting area on the end surface of the conductive tape away from the bottom film and located in the pasting area. The application has the effect of high processing efficiency for pasting the conductive sponge.

Description

A kind of conductive material forming process technical field [0001] The application relates to the technical field of conductive tape processing, in particular to a conductive material forming process. Background technique Conductive tape is a kind of metal foil or conductive cloth with high conductive back glue, and its conductive back glue and conductive base material are composed of complete The whole conductor can be bonded with any metal surface to complete the electrical overlap and the electrical sealing of the gap. The conductive tape combines the The softness of the cloth and the high conductivity of the conductive medium are widely used in plasma TVs, liquid crystal displays, mobile phones, and laptops. It is used in many consumer electronic products such as brains and desktop computers. At present, in order to have better load-bearing performance of the conductive tape, a layer of conductive tape is generally pasted on the conductive tape manually. The ...

AI Technical Summary

Problems solved by technology

[0005] In order to improve the problem of low processing efficiency of conductive adhesive tape and manual paste of conductive sponge, this application provides a conductive material forming process, which has the effect of high processing efficiency of pasted conductive sponge

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