Electronic packaging shell heat sink welding bottom structure

Abstract

The invention relates to the technical field of electronic packaging, and discloses an electronic packaging shell heat sink welding bottom structure, which comprises a heat sink welding bottom, a door plate, an extension column, a bottom frame and a top frame, wherein more than three groups of concave semicircular groove bodies are formed in the front side and the rear side of the bottom in the bottom frame at equal intervals; and a semi-cylindrical limiting block is integrally formed at the front end of each groove body, a cylindrical through hole body is formed in the middle of each limiting block, and a rectangular through rear door groove is formed in the right end of each bottom frame. According to the electronic packaging shell heat sink welding bottom structure, extension columns are correspondingly clamped with the groove bodies, so that pin columns are correspondingly clamped with the hole bodies, pins of an external electronic chip are correspondingly nested with the connecting holes in the top part of the storage plate, the pins are attached through tightening holes; and the pins are attached to the tightening holes, so that guide blocks and guide columns are connected to complete current connection, the electronic chip pin extension structure is independently subpackaged and then assembled on site, so that the whole electronic packaging shell cannot be scrapped due to the damage of a single structure, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a heat sink bottom welding structure of an electronic packaging shell. Background technique [0002] Many electronic packaging materials are made of ceramics, glass and metals. However, a new type of sealing material has been found, epoxy resin material, which is encapsulated with pure epoxy resin colloid. Compared with other materials, the sealing performance is better, and for some special instruments, it can be directly buried in the soil and used, and will not corrupt. [0003] With the continuous development of science and technology, the continuous improvement of the electronic industry, the continuous upgrading of the electronic supporting structure, and the continuous improvement of the requirements for the electronic package shell, the miniaturization of the package, the high density of the assembly and various new packaging technologies The continuous eme...

AI Technical Summary

Problems solved by technology

[0004] The heat sink in the electronic package refers to: the electronic package refers to the miniature heat sink, which is used to cool the electronic chip. Bending stress is caused by fatigue damage in the heat-affected zone of the weld due to multiple cold and heat cycles, and the overall replacement of the package requires the electronic chip to be taken out, which can easily lead to chip damage, and after the traditional package is connected to the electronic product, disassembly occurs. When solving the problem, the pins of the electronic chip are prone to bending or breaking, which seriously affects the working life of the chip. There is no structural back door. In the process of transportation and storage, the pin extension structure is prone to damage, which will lead to the scrapping of the entire electronic packaging shell, and the cost is relatively high

Images