Integrated circuit chip detection equipment and test method

A technology for integrated circuit and chip inspection, applied in electronic circuit testing, optical testing for flaws/defects, and the use of stable tension/pressure to test the strength of materials, etc. Poor contact, maintenance of cleanliness, and the effect of increasing the detection range

Active Publication Date: 2021-07-02
NINGBO QUNXIN MICRO-ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to make up for the deficiencies of the prior art and to solve the problem of low test efficiency and single test range when testing integrated circuit chips, the probes are usually manually aligned with the pins of the chip for testing. Integrated circuit chip testing equipment and testing method

Method used

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  • Integrated circuit chip detection equipment and test method
  • Integrated circuit chip detection equipment and test method
  • Integrated circuit chip detection equipment and test method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] like Figure 1 to Figure 4 As shown, a kind of integrated circuit chip testing equipment described in the present invention includes a base 1 and a bracket 12; the top of the base 1 is affixed with a placement seat 11; A cylinder 13 is connected; the expansion rod of the cylinder 13 is fixedly connected with a fixed plate 14, and the center of the bottom end of the fixed plate 14 is fixedly connected with a camera 15; the bottom end of the fixed plate 14 is fixedly connected with a pair of symmetrically distributed pressure rods 16; the placement seat 11 is provided with a probe 23; during work, in the prior art, when the integrated circuit chip is detected, the probe 23 is generally manually aligned to the pins of the chip for testing, and the test efficiency Low, and the range of testing is single, during the work of the present invention, the integrated circuit chip that needs to detect is put into placement seat 11, probe 23 and chip are corresponded to each other, ...

Embodiment approach

[0036] As an embodiment of the present invention, a first groove 2 is opened in the placement seat 11; a motherboard 24 is fixed to the bottom of the first groove 2 through a spring, and a group Probe 23; the bottom of the first groove 2 is fixed with a moving block 21 through a spring, and the moving block 21 is slidably connected to the side wall of the first groove 2; the top of the moving block 21 is provided with a placement groove 22, And the bottom of the groove 22 is provided with a group of guide holes 25 relative to the position of the probe 23; during work, when the pressure rod 16 is pressed on the chip, the moving block 21 will be pushed to move downward, and the moving block 21 will move downward to allow The probe 23 is in contact with the pins of the chip through the guide hole 25. After the contact, the pressing rod 16 continues to press down, and the pressing down will drive the motherboard 24 on the probe 23 to move down. After reaching the measured pressure ...

Embodiment 2

[0043] like Figure 5 to Figure 6 As shown, in the invention described a kind of integrated circuit chip detection equipment, the first rotating wheel 34 is an arc wheel, and the outer wall of the arc wheel is provided with a group of arc grooves 6, and the bottom of the arc groove 6 is A second elastic curved film 61 is fixedly connected to the elastic sheet, and the second elastic curved film 61 is fixed on the inner wall of the arc groove 6; the second elastic curved film 61 protrudes outward; The connecting column 62 is fixedly connected with a friction ball 63; when working, the probe 23 will drive the first rotating wheel 34 to rotate when it enters the guide hole 25, and after the first rotating wheel 34 is pushed to rotate 90°, the outer surface of the probe 23 and the first rotating wheel The end portion of wheel 34 slips, and when probe 23 breaks away from guide hole 25, because baffle plate 36 can contact with probe 23 earlier, this moment, probe 23 and the first tu...

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Abstract

The invention belongs to the technical field of chip detection equipment, and particularly relates to integrated circuit chip detection equipment and a test method. The equipment comprises a base and a support; a placing seat is fixedly connected with the top end of the base; an air cylinder is fixedly connected with the end surface, positioned right above the placing seat, of the support; a fixing plate is fixedly connected with a telescopic rod of the air cylinder, and a camera is fixedly connected with the center of the bottom end of the fixing plate; the bottom end of the fixing plate is fixedly connected with a pair of symmetrically-distributed pressing rods; and a probe is arranged in the placing seat. The invention provides the integrated circuit chip detection equipment and the test method, and aims to solve the problems that when an integrated circuit chip is detected, a probe is generally manually aligned with a pin of the chip for testing, the test efficiency is low, and the test range is single.

Description

technical field [0001] The invention belongs to the technical field of chip testing equipment, in particular to an integrated circuit chip testing equipment and a testing method. Background technique [0002] IC (Integrated Circμit, integrated circuit) chip is a kind of microelectronic device or component. It uses a certain process to interconnect components such as transistors, diodes, resistors, capacitors, and inductors required in a circuit, and interconnects them in a small circuit. One or several small semiconductor wafers or dielectric substrates, and then packaged in a package to become a microstructure with the required circuit functions. [0003] There are also some technical solutions for chip testing equipment in the prior art. For example, a Chinese patent with application number 2020205882860 discloses an fpga-based integrated circuit chip testing machine, including a feeding conveyor belt, a driving mechanism, a testing mechanism, The first unloading conveyor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01N3/02G01N3/08G01N21/95
CPCG01R31/2886G01R31/2893G01N3/02G01N3/08G01N21/95
Inventor 陈益群季学敏蔡毅
Owner NINGBO QUNXIN MICRO-ELECTRONICS CO LTD
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