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Warping deformation control method of space envelope forming of thin-walled components

A thin-walled member, deformation control technology, applied in the direction of instrument, geometric CAD, electrical digital data processing, etc. Improve the accuracy and yield, reduce the product development cycle, and effectively control the effect

Active Publication Date: 2022-05-06
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thickness of thin-walled components is small, and warping and deformation defects are easily generated during the space envelope forming process, resulting in a decrease in the forming accuracy and yield of thin-walled components

Method used

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  • Warping deformation control method of space envelope forming of thin-walled components
  • Warping deformation control method of space envelope forming of thin-walled components
  • Warping deformation control method of space envelope forming of thin-walled components

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Embodiment Construction

[0034] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

[0035] Such as figure 1 As shown, the thin-walled member space envelope forming warpage deformation control method of the present invention comprises the following steps:

[0036] S1. Determine the warping deformation control principle of the space envelope forming of thin-walled components (such as figure 1 shown). Among them, 1 is the main part of the envelope mold, 2 is the front part of the envelope mold, 3 is the component, and 4 is the lower mold. According to the geometric shape of the envelope mold, in a specific rectangular coordinate system, adjust the envelope center position of the envelope mold, offset the envelope mold, design the main part and front part of the envelope mold, optimize the process parame...

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Abstract

The invention relates to a method for controlling warpage deformation of a thin-walled component space envelope forming, comprising the following steps: S1, establishing a rectangular coordinate system; S2, enveloping center O of the envelope mold 1 On the z axis, the center of the envelope mode envelope O 1 The distance between the coordinate origin O and the coordinate origin O is H; S3, the offset of the envelope mold cone point; S4, the design of the main part of the envelope mold; S5, the design of the front part of the envelope mold; S6, the optimization of process parameters; S7, the thin-walled component space Warpage deformation control in envelope forming; plastic deformation with reduced wall thickness and increased diameter occurs during the envelope forming process of thin-walled components. The contact area between the main part of the envelope mold and the blank is on the side of the central axis, and the front end of the envelope mold The contact area between the part and the blank is on the other side of the central axis, so that the warpage deformation control of the space envelope forming of the thin-walled member can be realized. The invention can realize precise control of warping deformation of the thin-walled component space envelope forming, and further improve the space envelope forming precision and yield of the thin-walled component.

Description

technical field [0001] The invention relates to the field of manufacturing thin-walled components, in particular to a method for controlling warping deformation of thin-walled components in space envelope forming. Background technique [0002] Thin-walled components are key components of high-end equipment and are widely used in aircraft, spacecraft, ships, etc. Thin-walled components have harsh service conditions and high assembly requirements, which put forward strict requirements on the mechanical properties and precision of thin-walled components. At present, the main manufacturing method of thin-walled components is mechanical processing, which can manufacture high-precision thin-walled components, but the streamline of thin-walled components is destroyed, and the performance of thin-walled components is difficult to guarantee. [0003] The space enveloping forming method is a new method of continuous local plastic forming, which has the advantages of small forming loa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/17G06F119/14
CPCG06F30/17G06F2119/14
Inventor 韩星会华林胡亚雄
Owner WUHAN UNIV OF TECH
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