Equidistant cutting structure and automatic dicing device for soya bean product processing

A bean product, equidistant technology, applied in metal processing and other directions, can solve the problems of low cutting efficiency and non-adjustable cutting distance, and achieve the effect of improving cutting efficiency

Pending Publication Date: 2021-07-09
付宸羲
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The cutting distance of the existing bean product cutting device cannot be adjusted, and the cutting efficiency is low

Method used

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  • Equidistant cutting structure and automatic dicing device for soya bean product processing
  • Equidistant cutting structure and automatic dicing device for soya bean product processing
  • Equidistant cutting structure and automatic dicing device for soya bean product processing

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] In addition, an element in the present invention is said to be "fixed" or "disposed on" another element, and it may be directly on another element or an intervening element may also exist. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purp...

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PUM

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Abstract

The invention relates to the technical field of food processing, in particular to an equidistant cutting structure and an automatic dicing device for soya bean product processing. The equidistant cutting structure comprises a workbench, wherein a fixing frame is fixedly installed on the upper surface of the workbench, a lifting assembly is installed inside the fixing frame, a fixing rod is installed on the lifting assembly, adjusting blocks are equidistantly distributed on the fixing rod, and cutting tools are fixedly installed on the lower surfaces of the adjusting blocks. Soya bean products to be cut are placed on a rotating assembly, hydraulic cylinders are controlled to stretch, and the distance between a guide rod and the fixing rod can be adjusted, so that the distance between the cutting tools is adjusted, the rotating assembly is operated to drive the soya bean products to rotate, the cutting angle is adjusted, the lifting assembly is controlled to work, the cutting tools are driven to move up and down, the soya bean products are cut into blocks through the cutting tools, the whole process is automatically carried out, and the cutting efficiency is greatly improved by arranging the plurality of cutting tools.

Description

technical field [0001] The invention relates to the technical field of food processing, in particular to an equidistant dividing structure and an automatic cutting device for bean product processing. Background technique [0002] Soy products are processed foods made from soybeans, adzuki beans, green beans, peas, broad beans and other beans as the main raw materials. Most soy products are tofu and its re-products made from coagulated soybean milk. There are many kinds of soy products, such as tofu, shredded tofu, fermented bean curd, soy milk, tempeh, soy sauce, bean sausage, bean gluten, bean fish, shredded sheep tripe, cat ears, vegetarian chicken wings, soybean ears, etc. [0003] During the production and processing of soybean products, a cutting device is needed to cut the soybean products into blocks. The cutting distance of the existing bean product cutting device cannot be adjusted, and the cutting efficiency is low. Contents of the invention [0004] The objec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D1/09B26D5/04B26D5/08B26D7/01B26D7/26
CPCB26D1/09B26D5/04B26D5/086B26D7/01B26D7/2628B26D2210/02
Inventor 付宸羲
Owner 付宸羲
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