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High-temperature-resistant glass fiber non-woven fabric single-sided copper-clad plate

A technology of glass fiber cloth and glass fiber, which is applied in the field of glass fiber non-woven single-sided copper-clad laminates. The effect of high temperature

Pending Publication Date: 2021-07-09
江西省瑞烜新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this invention is to solve the shortcomings of poor high temperature resistance and poor surface insulation performance of the existing copper plate processing, and propose a high temperature resistant glass fiber non-woven single-sided copper clad laminate

Method used

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  • High-temperature-resistant glass fiber non-woven fabric single-sided copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] refer to figure 1 , a high temperature resistant glass fiber non-woven single-sided copper clad laminate, including copper foil 1, epoxy resin 2, glass fiber cloth 3 and glass fiber non-woven fabric 4, epoxy resin 2 is two parts, and the epoxy resin Resin 2 includes the following important components: high temperature resistant adhesive, insulating agent, catalyst, defoamer and insulating resin, and the specific processing method of high temperature resistant glass fiber non-woven single-sided copper clad laminate includes the following steps;

[0030] S1: first prepare epoxy resin 2;

[0031] S2: processing the glass fiber cloth 3 and the glass fiber non-woven fabric 4;

[0032] S3: first preheat the copper foil 1, and apply the first epoxy resin 2;

[0033] S4: laying the glass fiber cloth 3 on the outside of the first epoxy resin 2 and compacting it;

[0034] S5: apply a second portion of epoxy resin 2 on the outside of the glass fiber cloth 3;

[0035] S6: layin...

Embodiment 2

[0048] refer to figure 1 , a high temperature resistant glass fiber non-woven single-sided copper clad laminate, including copper foil 1, epoxy resin 2, glass fiber cloth 3 and glass fiber non-woven fabric 4, epoxy resin 2 is two parts, and the epoxy resin Resin 2 includes the following important components: high temperature resistant adhesive, insulating agent, catalyst, defoamer and insulating resin, and the specific processing method of high temperature resistant glass fiber non-woven single-sided copper clad laminate includes the following steps;

[0049] S1: first prepare epoxy resin 2;

[0050] S2: processing the glass fiber cloth 3 and the glass fiber non-woven fabric 4;

[0051] S3: first preheat the copper foil 1, and apply the first epoxy resin 2;

[0052] S4: laying the glass fiber cloth 3 on the outside of the first epoxy resin 2 and compacting it;

[0053] S5: apply a second portion of epoxy resin 2 on the outside of the glass fiber cloth 3;

[0054] S6: layin...

Embodiment 3

[0067] refer to figure 1 , a high temperature resistant glass fiber non-woven single-sided copper clad laminate, including copper foil 1, epoxy resin 2, glass fiber cloth 3 and glass fiber non-woven fabric 4, epoxy resin 2 is two parts, and the epoxy resin Resin 2 includes the following important components: high temperature resistant adhesive, insulating agent, catalyst, defoamer and insulating resin, and the specific processing method of high temperature resistant glass fiber non-woven single-sided copper clad laminate includes the following steps;

[0068] S1: first prepare epoxy resin 2;

[0069] S2: processing the glass fiber cloth 3 and the glass fiber non-woven fabric 4;

[0070] S3: first preheat the copper foil 1, and apply the first epoxy resin 2;

[0071] S4: laying the glass fiber cloth 3 on the outside of the first epoxy resin 2 and compacting it;

[0072] S5: apply a second portion of epoxy resin 2 on the outside of the glass fiber cloth 3;

[0073] S6: layin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Abstract

The invention belongs to the technical field of copper plates, particularly relates to a high-temperature-resistant glass fiber non-woven fabric single-sided copper-clad plate, and aiming at solving the problems that an existing copper plate is poor in high-temperature resistance and surface insulation performance in processing, provides the following scheme: the copper-clad plate comprises copper foil, epoxy resin, glass fiber cloth and glass fiber non-woven fabric, and a specific processing mode comprises the following steps: S1, firstly, epoxy resin is prepared; S2, the glass fiber cloth and the glass fiber non-woven fabric are treated; S3, the copper foil is preheated firstly, and a first part of epoxy resin is smeared; S4, glass fiber cloth is laid on the outer side of the first part of epoxy resin and compacted; S5, a second part of epoxy resin is smeared on the outer side of the glass fiber cloth; S6, the glass fiber non-woven fabric is laid on the outer side of the second part of epoxy resin and compacted, and the high-temperature-resistant glass fiber non-woven fabric single-face copper-clad plate is prepared; and S7, baking and curing are conducted. The surface insulation performance and the high temperature resistance can be improved.

Description

technical field [0001] The invention relates to the technical field of copper plates, in particular to a high-temperature-resistant glass fiber non-woven fabric single-sided copper-clad plate. Background technique [0002] The electronics industry has higher and higher requirements for printed circuit boards, especially for the heat resistance and conductivity of printed circuit boards. In the past, the basic materials of various electronic devices mostly use laminates, and copper clad laminates (CopperCladLaminate , referred to as CCL) is the mainstream basic material for manufacturing PCBs, and the substrate is formed by thermoforming a resin matrix and copper foil. [0003] At present, the existing copper plate processing has poor high temperature resistance and poor surface insulation performance. Contents of the invention [0004] The purpose of the present invention is to solve the disadvantages of poor high temperature resistance and poor surface insulation perform...

Claims

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Application Information

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IPC IPC(8): B32B15/092B32B15/20B32B17/02B32B17/10B32B27/12B32B27/38H05K1/03H05K1/05
CPCB32B15/092B32B15/20B32B27/12B32B27/38B32B2262/101B32B2307/306H05K1/0366H05K1/056H05K2201/012
Inventor 况小军曾杰书叶志
Owner 江西省瑞烜新材料有限公司