Mask defect detection method and system based on AOI system
A technology of defect detection and reticle, which is applied in the photolithographic process of patterned surface, originals for photomechanical processing, semiconductor/solid-state device testing/measurement, etc., which can solve product rework, repair time and process difficulty increase, Affect the correct judgment of product defects and other issues, to achieve the effect of improving manufacturing accuracy and product quality, simple and reliable implementation methods, and shortening the product manufacturing cycle
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Embodiment 1
[0057] Such as figure 1 As shown, this embodiment provides a false defect detection method for AOI horizontal lines on a reticle based on the present invention, such as figure 1 shown, including the following steps:
[0058] S1. Scan the Mask substrate to be detected to obtain the scanning pattern of the Mask substrate;
[0059] S2. Based on the mask substrate scanning pattern and the mask substrate standard image, perform preliminary defect marking on the mask substrate scanning pattern to obtain preliminary defect point information;
[0060] S3. Perform a re-inspection (Review) for each preliminary defect point according to the preliminary defect point information;
[0061] S4. If the total number of AOI false defects is determined to be within the normal range (DEF Total≤300) according to the re-inspection results, execute S5; if the number of AOI horizontal line false defects exceeds the standard (DEF Total>300), execute S1;
[0062] S5. Complete re-inspection of all d...
Embodiment 2
[0068] Such as image 3 As shown, this embodiment provides a method for detecting false defects on the AOI edge of the reticle based on the present invention, including the following steps:
[0069] S1. Scan the Mask substrate to be detected to obtain the scanning pattern of the Mask substrate;
[0070] S2. Based on the mask substrate scanning pattern and the mask substrate standard image, perform preliminary defect marking on the mask substrate scanning pattern to obtain preliminary defect point information;
[0071] S3. Perform a re-inspection (Review) for each preliminary defect point according to the preliminary defect point information;
[0072] S4. If the total number of AOI false defects is determined to be within the normal range (DEF Total≤300) according to the re-inspection results, then execute S5; if the number of AOI edge false defects exceeds the standard (DEF Total>300), then return to S1 ;
[0073] S5. Complete re-inspection of all defect points, and record ...
Embodiment 3
[0078] Such as Figure 5 As shown, this embodiment provides a method for detecting false defects at the corners of AOI reticle based on the present invention, including the following steps:
[0079] S1. Scan the Mask substrate to be detected to obtain the scanning pattern of the Mask substrate;
[0080] S2. Based on the mask substrate scanning pattern and the mask substrate standard image, perform preliminary defect marking on the mask substrate scanning pattern to obtain preliminary defect point information;
[0081] S3. Perform a re-inspection (Review) for each preliminary defect point according to the preliminary defect point information;
[0082] S4. If the total number of AOI false defects is determined to be within the normal range (DEF Total≤300) according to the re-inspection results, then execute S5; if the number of AOI corner false defects exceeds the standard (DEF Total>300), then return to S1 ;
[0083] S5. Complete re-inspection of all defect points, and recor...
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