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A kind of protective glue for wafer cutting

A protective glue and wafer technology, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of low tensile strength of liquid protective glue, poor adhesion of silicon interface, etc., and achieve silicon interface Good bonding force, strong tensile strength, and the effect of protecting chips

Active Publication Date: 2022-07-29
HUBEI CHOICE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the application provides a protective glue for wafer dicing, which aims to solve the problems of low tensile strength and poor adhesion of the silicon interface of the existing liquid protective glue

Method used

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  • A kind of protective glue for wafer cutting
  • A kind of protective glue for wafer cutting
  • A kind of protective glue for wafer cutting

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preparation example Construction

[0042] The present application also provides a method for preparing the protective adhesive for wafer cutting, which comprises the following steps:

[0043] Step S1: providing 15-39 parts by mass of epoxy resin, 10-40 parts by mass of curing agent, 0.1-3 parts by mass of curing accelerator, 35-85 parts by mass of inorganic filler, and 1-4 parts by mass of auxiliary agent And the coupling agent of 0.1-5 mass parts, obtain the mixture after mixing;

[0044] Step S2: grinding the mixture until the mixture becomes a gel, and vacuum defoaming to obtain a protective glue for wafer cutting.

[0045] It can be understood that 0.1-3 parts by mass of a colorant may also be added in the step S1.

[0046] The grinding method in the step S2 is a grinding method known in the art for preparing an adhesive. In at least one embodiment, the mixture is ground using a three-roll mill.

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Abstract

The present application discloses a protective adhesive for wafer cutting, comprising 15-39 parts by mass of epoxy resin, 10-40 parts by mass of a curing agent, 0.1-3 parts by mass of a curing accelerator, and 35-85 parts by mass of an epoxy resin. Inorganic filler, 1-4 parts by mass of auxiliary agent and 0.1-5 parts by mass of coupling agent, the auxiliary agent is composed of bisphenol A epoxy resin and / or bisphenol F epoxy resin and dendritic resin containing polyhydroxy at the end The crosslinking agent is reacted to obtain. The protective adhesive for wafer dicing of the present application has strong tensile strength, silicon interface adhesion and good fluidity under the synergistic effect of its components and proportions. When used for wafer cutting, it can be directly coated on the surface of the wafer by inkjet printing, filled in the pre-cut slit, and acted on the surrounding weirs of the chip, and the protective glue for wafer cutting is not easy to It is separated or detached from the chip and the substrate, and has better cushioning performance, which can effectively protect the chip.

Description

technical field [0001] The present application relates to the technical field of wafer cutting, and in particular, to a protective adhesive for wafer cutting. Background technique [0002] With the increasingly fierce competition in the industry, chip design and manufacturing companies need to continuously reduce manufacturing costs to improve market competitiveness. In the chip fabrication process, generally hundreds to thousands or even tens of thousands of individual chips are fabricated on a wafer, and then each individual chip is cut for subsequent fabrication. However, in the process of chip cutting, it is easy to cause chip damage, resulting in a decrease in the yield of the chip. [0003] In the prior art, the chips on the wafer are packaged and protected by protective glue, and then cut, so as to avoid chip damage and improve the chip fabrication yield. However, the existing liquid protective adhesive has low tensile strength and poor adhesion at the silicon inter...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C08G59/50C09J11/04C09J11/08
CPCC09J163/00C09J11/04C09J11/08C08G59/5033C08L2205/025C08L2203/20C08K2201/005C08L63/00C08K3/36
Inventor 伍得王义廖述杭苏峻兴李婷
Owner HUBEI CHOICE TECH CO LTD
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